WIRING SUBSTRATE AND PRODUCTION METHOD THEREFOR

Title:

WIRING SUBSTRATE AND PRODUCTION METHOD THEREFOR

Document Type and Number:

WIPO Patent Application WO/2013/108599

Kind Code:

A1

Abstract:

A wiring substrate, having an insulating resin layer, a plurality of wires, and a via hole conductor. The wires are arranged via the insulating resin layer and are formed using copper foil. The via hole conductor is provided so as to penetrate the insulating resin layer, and electrically connects the plurality of wires. The via hole conductor has a resin section and a metal section including copper, tin, and bismuth. The metal section includes: a first metal region including a conjugate of copper microparticles; a second metal region having as the main component thereof at least one among tin, a tin-copper alloy, and an intermetallic compound of tin and copper; and a third metal region having bismuth as the main component thereof. The weight composition ratio between copper, tin, and bismuth in the metal section is within a prescribed range in a ternary phase diagram. The surface of the copper foil that comes in contact with the via hole conductor is a rough surface having a skewness in a roughness curve of no more than 0. In addition, some of the copper microparticles come in surface contact with the rough surface of the copper foil, and at least one section of the second metal region is formed into the surface of the conjugate and the rough surface of the copper foil.

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Inventors:

KASHIWAGI TAKAFUMI
KAMADA ERI
OKUSHIMA YOSHIKI
NIIMI HIDEKI
IWASAWA AYAKO
NAKAMURA TADASHI

Application Number:

PCT/JP2013/000077

Publication Date:

July 25, 2013

Filing Date:

January 11, 2013

Export Citation:

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Assignee:

PANASONIC CORP (JP)

International Classes:

H05K3/46; B22F1/107; C22C9/00; C22C9/02; C22C13/00; C22C30/02; C22C30/04; H05K1/09; H05K1/11; H05K3/40; B23K35/26; C22C12/00

Foreign References:

JP2012134313A	2012-07-12
JP2011176220A	2011-09-08
JP2011199250A	2011-10-06
JP2011009267A	2011-01-13
JP2004241427A	2004-08-26
JP2002290052A	2002-10-04

Attorney, Agent or Firm:

NAITO, Hiroki et al. (JP)
Hiroki Naito (JP)

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