Title:
WIRING SUBSTRATE PROVIDED WITH SPACER LAYER BETWEEN IMPRINT LAYERS
Document Type and Number:
WIPO Patent Application WO/2019/035421
Kind Code:
A1
Abstract:
The present invention is provided with: a first imprint layer 25 in which first wiring 28 is formed in first wiring formation grooves 27 formed by locally recessing a surface of the first imprint layer; a second imprint layer 26 which is disposed so as to overlap the first imprint layer 25 on the side on which the first wiring 28 is formed, and in which second wiring 30 is formed in second wiring formation grooves 29 formed by locally recessing the surface of the second imprint layer that is on the side opposite the first imprint layer 25; and spacer layers 33 interposed between the first imprint layer 25 and the second imprint layer 26.
Inventors:
NOMA MIKIHIRO
Application Number:
PCT/JP2018/030066
Publication Date:
February 21, 2019
Filing Date:
August 10, 2018
Export Citation:
Assignee:
SHARP KK (JP)
International Classes:
G06F3/041; B32B3/30; G06F3/044; H05K3/10
Foreign References:
| JP3192251U | 2014-08-07 | |||
| JP2015133090A | 2015-07-23 | |||
| JP2015509255A | 2015-03-26 | |||
| JP2015501502A | 2015-01-15 | |||
| JP2013156975A | 2013-08-15 |
Attorney, Agent or Firm:
AKATSUKI UNION PATENT FIRM (JP)
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