Title:
WIRING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2020/230552
Kind Code:
A1
Abstract:
The present invention enhances the effect of insulating bus bars from each other. The wiring substrate is provided with a first conducting plate, a second conducting plate, and a first insulating body. A first end of a element and a second end of the element are connected to a first principal surface of the first conducting plate and a first principal surface of the second conducting plate, respectively. The first insulating body has a first portion and a second portion. The first portion separates the first conducting plate and the second conducting plate from each other. The second portion is continuous with the first portion and covers at least a part of the first principal surface. The first portion includes an end portion. The end portion projects from the second principal surface toward the side opposite to the first principal surface or from the second principal surface toward the side opposite to the first principal surface.
Inventors:
NAKAMURA ARINOBU (JP)
Application Number:
PCT/JP2020/017273
Publication Date:
November 19, 2020
Filing Date:
April 22, 2020
Export Citation:
Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H02G3/16; H05K1/02
Domestic Patent References:
| WO2018198872A1 | 2018-11-01 | |||
| WO2016114098A1 | 2016-07-21 |
Foreign References:
| JP2018117473A | 2018-07-26 | |||
| JP2017132355A | 2017-08-03 | |||
| JP2001197627A | 2001-07-19 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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