Title:
WIRING TOOL
Document Type and Number:
WIPO Patent Application WO/2023/112721
Kind Code:
A1
Abstract:
The present disclosure addresses the problem of providing a wiring tool that can effectively use the limited space inside the tool. This wiring tool (1) comprises: a first substrate (e.g., parent substrate 100) on which a first circuit block (2) is disposed; and a second substrate (e.g., child substrate 200) on which a second circuit block (3) is disposed. The first circuit block (2) includes at least one circuit among: a circuit that outputs a signal to the second circuit block (3); and a circuit that receives a signal from the second circuit block (3). The second substrate is electrically connected to the first substrate.
Inventors:
YAMAMOTO JUNKI
SUZUKI SATOSHI
DONG SIHAN
SUZUKI SATOSHI
DONG SIHAN
Application Number:
PCT/JP2022/044541
Publication Date:
June 22, 2023
Filing Date:
December 02, 2022
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H01R25/00; H01R13/66; H02G3/12; H05K7/14; H05K7/20
Foreign References:
| JP2018174684A | 2018-11-08 | |||
| CN213846302U | 2021-07-30 | |||
| US20170187155A1 | 2017-06-29 | |||
| US20210203099A1 | 2021-07-01 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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