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Title:
WORK HOLDING VESSEL AND WORK DISMOUNTING METHOD FOR REFLOW DEVICE
Document Type and Number:
WIPO Patent Application WO/2007/055149
Kind Code:
A1
Abstract:
[PROBLEMS] To provide a work holding vessel and a work dismounting method for containing a liquid member and dismounting a work without breaking the work. [MEANS FOR SOLVING PROBLEMS] A work holding vessel (10) can contain a liquid soldering composition and can hold a work (W) such as a wafer by placing it horizontally. The work holding vessel (10) has a bottom (11) and a circumferential wall (12) standing at the outer circumference of the bottom (11). Three pin-shaped work placing members (13) protrude from the bottom (11) at a substantially identical interval on the bottom (11) for placing the work (W) with a small contact area.

Inventors:
SAITO HIROSHI (JP)
ONOZAKI JUNICHI (JP)
FURUNO MASAHIKO (JP)
SHIRAI MASARU (JP)
Application Number:
PCT/JP2006/321953
Publication Date:
May 18, 2007
Filing Date:
November 02, 2006
Export Citation:
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Assignee:
TAMURA SEISAKUSHO KK (JP)
SAITO HIROSHI (JP)
ONOZAKI JUNICHI (JP)
FURUNO MASAHIKO (JP)
SHIRAI MASARU (JP)
International Classes:
B23K3/06; B23K1/00; B23K3/00; H01L21/60; H05K3/34; B23K101/42
Domestic Patent References:
WO2005091354A12005-09-29
WO2005096367A12005-10-13
Attorney, Agent or Firm:
TAKAHASHI, Isamu (Shinoda Bldg. 10-7, Higashi Kanda 1-chome, Chiyoda-k, Tokyo 31, JP)
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