Title:
WORKPIECE BONDING METHOD AND LIGHT IRRADIATION APPARATUS
Document Type and Number:
WIPO Patent Application WO/2016/186200
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a workpiece bonding method by which three workpieces can be efficiently bonded together while obtaining an expected bonding state without causing an increase in the complexity or size of the apparatus structure, and a light irradiation apparatus used in the bonding method.
The workpiece bonding method according to the present invention is a method for bonding a second workpiece and a third workpiece to both surfaces of a first workpiece, the first workpiece being made from an ultraviolet transmitting material, and the method comprising: an ultraviolet irradiation step of irradiating bonding surfaces of the respective workpieces with ultraviolet light; and a bonding step of laminating and bonding the respective workpieces together such that the respective bonding surfaces irradiated with the ultraviolet light adhere closely to each other. The ultraviolet irradiation step for the first workpiece is performed with the respective bonding surfaces of the first workpiece exposed to an oxygen-containing atmosphere. The light irradiation apparatus according to the present invention is provided with a holding mechanism that holds the first workpiece with the respective bonding surfaces thereof exposed to the oxygen-containing atmosphere.
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Inventors:
WASAMOTO MAKOTO (JP)
TAKEMOTO FUMITOSHI (JP)
SUZUKI SHINJI (JP)
TAKEMOTO FUMITOSHI (JP)
SUZUKI SHINJI (JP)
Application Number:
PCT/JP2016/064999
Publication Date:
November 24, 2016
Filing Date:
May 20, 2016
Export Citation:
Assignee:
USHIO ELECTRIC INC (JP)
International Classes:
B29C65/14; B32B37/16
Domestic Patent References:
| WO2008087800A1 | 2008-07-24 |
Foreign References:
| JP2009098464A | 2009-05-07 | |||
| JP2010089466A | 2010-04-22 | |||
| JP2008019348A | 2008-01-31 | |||
| JP2013149072A | 2013-08-01 | |||
| JP2014021081A | 2014-02-03 |
Attorney, Agent or Firm:
OHI, Masahiko (JP)
大井 正彦 (JP)
大井 正彦 (JP)
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