Title:
WORKPIECE DOUBLE-FACE POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/059790
Kind Code:
A1
Abstract:
A workpiece double-face polishing method according to the present invention is for polishing both faces of a workpiece by, with respect to a carrier plate having at least one holding hole for holding a workpiece, holding the workpiece in the holding hole, the method comprising: a step for acquiring a relationship between the inner circumferential diameter of the holding hole and the edge roll-off amount of the workpiece; a step for determining the inner circumferential diameter of the holding hole on the basis of a desired edge roll-off amount and the acquired relationship between the inner circumferential diameter of the holding hole and the edge roll-off amount of the workpiece; and a step for performing double-face polishing on the workpiece by using the carrier plate having the holding hole having the determined inner circumferential diameter.
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Inventors:
NONAKA EISUKE (JP)
HIRAIWA KOJIRO (JP)
HIRAIWA KOJIRO (JP)
Application Number:
PCT/JP2020/030798
Publication Date:
April 01, 2021
Filing Date:
August 13, 2020
Export Citation:
Assignee:
SUMCO CORP (JP)
International Classes:
B24B37/28; H01L21/304
Foreign References:
| JP2014050913A | 2014-03-20 | |||
| JP2002331453A | 2002-11-19 | |||
| JP2006156653A | 2006-06-15 | |||
| JP2010253579A | 2010-11-11 |
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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