Title:
WORKPIECE HANDLING SHEET AND DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/201766
Kind Code:
A1
Abstract:
Provided is a workpiece handling sheet 1 comprising: a substrate 11; and an boundary surface ablation layer 12 which is laminated on one surface of the substrate 11 and which can hold small workpieces and perform boundary surface ablation by irradiation with a laser beam, wherein the boundary surface ablation layer 12 contains a photoinitiator, and the workpiece handling sheet has a 355 nm wavelength light ray absorbance of 1.5 or more. This workpiece handling sheet allows for proper handling even of very small workpieces.
Inventors:
FURUNO KENTA (JP)
FUKUMOTO AKIO (JP)
WAKAYAMA YOJI (JP)
FURUKAWA YOSHIKI (JP)
FUKUMOTO AKIO (JP)
WAKAYAMA YOJI (JP)
FURUKAWA YOSHIKI (JP)
Application Number:
PCT/JP2022/000964
Publication Date:
September 29, 2022
Filing Date:
January 13, 2022
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
B32B27/00; B32B7/023; B32B27/16; B32B27/18; C09J7/38; C09J11/06; C09J133/14; F21S2/00; G09F9/00; H01L21/301
Domestic Patent References:
| WO2019207920A1 | 2019-10-31 |
Foreign References:
| JP2020188261A | 2020-11-19 | |||
| JP2014515883A | 2014-07-03 | |||
| JP2010251359A | 2010-11-04 |
Attorney, Agent or Firm:
HAYAKAWA Yuzi et al. (JP)
Download PDF:
Previous Patent: WORKPIECE HANDLING SHEET AND DEVICE MANUFACTURING METHOD
Next Patent: WORKPIECE HANDLING SHEET AND DEVICE MANUFACTURING METHOD
Next Patent: WORKPIECE HANDLING SHEET AND DEVICE MANUFACTURING METHOD