Title:
WORKPIECE PICKING METHOD AND WORKPIECE PICKING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2023/013056
Kind Code:
A1
Abstract:
A workpiece picking method for picking workpieces supplied onto a supply stage in a dispersed manner, the supply stage being wider than an image capturing range corresponding to the angle of view of an image capturing unit, the workpiece picking method comprising: (a) a step for performing, in each of a plurality of regions of the supply stage divided on the basis of the image capturing range, a picking process for selecting a pickable workpiece on the basis of an image of the region captured by the image capturing unit, and causing a picking unit to pick the workpiece; (b) a step for acquiring, for each region, a remaining number of workpieces remaining after the picking process; (c) a step for supplying new workpieces onto the supply stage and performing a disentangling operation for disentangling a mass of workpieces, or performing the disentangling operation without supplying new workpieces, on the basis of the remaining number of workpieces in each region; and (d) a step for performing a picking process, after the disentangling operation, in a largest-number region in which the remaining number of workpieces acquired for each of the regions after the picking process is largest.
Inventors:
NISHIMOTO TAKESHI (JP)
Application Number:
PCT/JP2021/029400
Publication Date:
February 09, 2023
Filing Date:
August 06, 2021
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
B23P19/00; H05K13/02
Domestic Patent References:
| WO2019097650A1 | 2019-05-23 |
Foreign References:
| JP2016219472A | 2016-12-22 | |||
| JP2020055059A | 2020-04-09 | |||
| JP2020116717A | 2020-08-06 | |||
| JP2017042859A | 2017-03-02 |
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
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