Title:
WORKPIECE PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2016/079923
Kind Code:
A1
Abstract:
The present invention is a workpiece processing apparatus comprising: an upper surface plate support mechanism for supporting an upper surface plate from above so as to allow vertical movement using a cylinder that extends along the direction of the rotation axis of the upper surface plate; a horizontal plate fixed on said cylinder so that the main surface is perpendicular to the longitudinal axis of the cylinder; at least three displacement sensors for measuring height positions of the surface of the horizontal plate when the upper surface plate is lowered to a fixing position; and a control device capable of calculating the relative height position of the upper surface plate and the angle formed by the rotation axis of the upper surface plate and the longitudinal axis of the cylinder from the height positions for the surface of the horizontal plate measured by the displacement sensors. As a result, it is possible to detect workpiece holding problems in a short time and with good precision prior to workpiece processing and prevent damage of the workpieces and the processing apparatus and possible to detect eccentric angles of the cylinder during workpiece processing and limit worsening of workpiece quality.
Inventors:
YASUDA TAICHI (JP)
ENOMOTO TATSUO (JP)
ENOMOTO TATSUO (JP)
Application Number:
PCT/JP2015/005308
Publication Date:
May 26, 2016
Filing Date:
October 21, 2015
Export Citation:
Assignee:
SHINETSU HANDOTAI KK (JP)
International Classes:
B24B37/34; B24B37/08; H01L21/304
Foreign References:
| JPH02106269A | 1990-04-18 | |||
| JP2013078826A | 2013-05-02 | |||
| JP2008036802A | 2008-02-21 |
Attorney, Agent or Firm:
YOSHIMIYA, Mikio (JP)
Good Miya Mikio (JP)
Good Miya Mikio (JP)
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