Title:
WORKPIECE PROVISIONAL BONDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/009770
Kind Code:
A1
Abstract:
The present invention makes it possible to easily and reliably position a base sheet member and a cover sheet member when the cover sheet member is provisionally bonded to the base sheet member during production of a flexible printed circuit board. A base sheet member 4 is mounted on a stripper plate 25, and, when the base sheet member 4 and a cover sheet member 3 are lowered, long pins 23a are inserted into positioning holes 24 at the four corners of the base sheet member 4. When the cover sheet member 3 is laid over the base sheet member 4, the long pins 23a are inserted into positioning holes 24 at the four corners of the cover sheet member 3. The sheet members 3, 4 are lowered further, and short pins 23b are inserted into positioning holes 24 in each of the sheet members 3, 4. The cover sheet member 3 is pressed onto the base sheet member 4 by a pressing plate 2c, and the cover sheet member 3 and the base sheet member 4 are provisionally bonded. The cover sheet member 3 and the base sheet member 4 are point bonded by protrusions 2d on the pressing plate 2c.
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Inventors:
FUJIMURA TAKAYUKI (JP)
ISE TAKASHI (JP)
TAKAGI HIROKI (JP)
MORISHITA KIMITO (JP)
ISE TAKASHI (JP)
TAKAGI HIROKI (JP)
MORISHITA KIMITO (JP)
Application Number:
PCT/JP2023/022901
Publication Date:
January 11, 2024
Filing Date:
June 21, 2023
Export Citation:
Assignee:
NIPPON MEKTRON KK (JP)
International Classes:
B29C65/02
Domestic Patent References:
| WO2009063906A1 | 2009-05-22 |
Foreign References:
| JPH0664047A | 1994-03-08 | |||
| JP2003159753A | 2003-06-03 | |||
| JP2005288717A | 2005-10-20 |
Attorney, Agent or Firm:
OKUMACHI Tetsuyuki (JP)
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