Title:
WORKPIECE SEPARATION DEVICE AND WORKPIECE SEPARATION METHOD
Document Type and Number:
WIPO Patent Application WO/2019/244742
Kind Code:
A1
Abstract:
In order to uniformly irradiate a separation layer of a laminate, this workpiece separation device is characterized in that a laminate, in which a workpiece including a circuit board and a supporter that transmits a laser beam are laminated via a separation layer that degenerates to be peelable by absorbing the laser beam, is provided with a holding member that holds the workpiece in an attachable/detachable manner, a laser irradiation unit that irradiates the separation layer with Gaussian beams pulse-generated as the laser beam by passing through a support body of the laminate held by the holding member; and a control unit that controls the operation of the laser irradiation unit, wherein the intervals between the centers of the adjacent Gaussian beams are controlled to be smaller than three times the standard deviation when the relationship between the beam diameters and the irradiation intensity in the beam profile of the Gaussian beams is assumed as a normal distribution.
Inventors:
OHTANI YOSHIKAZU (JP)
TOMIOKA KYOUHEI (JP)
TOMIOKA KYOUHEI (JP)
Application Number:
PCT/JP2019/023269
Publication Date:
December 26, 2019
Filing Date:
June 12, 2019
Export Citation:
Assignee:
SHIN ETSU ENG CO LTD (JP)
International Classes:
H01L21/02; B23K26/04; B23K26/57; H01L21/301; H01L21/683
Foreign References:
| JP2012024783A | 2012-02-09 | |||
| JP2012191112A | 2012-10-04 |
Attorney, Agent or Firm:
EICHI PATENT & TRADEMARK CORP. (JP)
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