Title:
X-RAY INSPECTION METHOD AND DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/098795
Kind Code:
A1
Abstract:
In this method, in order to detect internal defects with high accuracy and without causing the overlapping of adjacent TSV transmission images when inspecting, using an X-ray transmission image, internal defects in a TSV formed in a semiconductor wafer, defects inside a TSV formed on a sample are detected by irradiating the sample with X-rays emitted from an X-ray source, detecting the X-rays, and processing an X-ray transmission image. Therein, the detection, using an X-ray detector, of X-rays transmitted through the sample is configured such that: the detection azimuth of the X-rays, which are transmitted through the sample and detected by the X-ray detector, relative to the sample, and the detection elevation angle of the X-rays relative to the X-ray source are determined on the basis of information on the arrangement interval, depth, and planar shape of structures formed in the sample; the angle of rotation of a rotating stage on which the sample is mounted is adjusted in accordance with the detection azimuth which has been determined; and the X-rays that have been transmitted through the sample are detected with the position of the detector set to the detection elevation angle which has been determined.
Inventors:
NAKAO TOSHIYUKI (JP)
URANO YUTA (JP)
ZHANG KAIFENG (JP)
SASAZAWA HIDEAKI (JP)
URANO YUTA (JP)
ZHANG KAIFENG (JP)
SASAZAWA HIDEAKI (JP)
Application Number:
PCT/JP2015/085155
Publication Date:
June 23, 2016
Filing Date:
December 16, 2015
Export Citation:
Assignee:
HITACHI HIGH TECH CORP (JP)
International Classes:
G01N23/04; G01B15/00; G01B15/08; G01N23/083; G01N23/18
Foreign References:
| JP2009085923A | 2009-04-23 | |||
| JP2013130392A | 2013-07-04 | |||
| JP2009174972A | 2009-08-06 | |||
| US20030095631A1 | 2003-05-22 |
Attorney, Agent or Firm:
SEIRYO I. P. C. (JP)
青稜 patent business corporation (JP)
青稜 patent business corporation (JP)
Download PDF: