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WO/2024/097974A1 |
The subject application relates to bonded abrasive with low wetting bond material. An abrasive article including a bonded abrasive body having a particular MOR/EMOD ratio associated with a particular bond vol%. The body also can include ...
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WO/2024/098015A1 |
The subject application relates to a bonded abrasive for gear power honing. An abrasive article including a bonded abrasive body having abrasive particles and a bond material. The abrasive body can include an inner annular surface with a...
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WO/2024/094145A1 |
Disclosed in the present invention is an electrochemical mechanical polishing and planarization system for CMP equipment, comprising: power supplies each provided with a first electrode and a second electrode; polishing heads connected t...
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WO/2024/095770A1 |
This eyeglass lens machining device comprises: a period information acquisition means which acquires period information indicating a prescribed period in which consumables are used in the eyeglass lens machining device; a machining infor...
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WO/2024/094542A1 |
A precision tool (1), in particular for use in a hand tool with an elongate main body which configures a shank (10) in a first end region and has a triangular cross section in a second end region. Each side of the triangle forms a surfac...
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WO/2024/095997A1 |
This polishing device comprises: a polishing table that supports a polishing pad; a polishing head capable of pressing a substrate onto a polishing surface of the polishing pad; and a processor that estimates a polishing index of the pol...
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WO/2024/097395A1 |
A steady rest has working and right-hand cover plates and a central plate sandwiched there between. The working cover plate has upper and lower guide tracks and track engagement springs that are received within cavities. The central plat...
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WO/2024/094534A1 |
The invention relates to an abrasive element for an abrasive (15), in particular a flexible abrasive (15), preferably an abrasive disc, for abrading a workpiece with a main abrasive element (13). According to the invention, the abrasive ...
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WO/2024/094773A1 |
A tool device for use with a hand-held oscillation machine tool has at least one working region which is suitable for acting on a workpiece. The machine tool has a drive shaft with a machine connector device with an inner profile which w...
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WO/2024/089433A1 |
A mandrel (1) for holding an ophthalmic lens member blank (52) during machining is disclosed. The mandrel (1) comprises a front surface (6) for receiving an ophthalmic lens member blank (52) to be machined; a rear surface (8) opposite th...
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WO/2024/087328A1 |
The present invention relates to the technical field of damping cloths. Disclosed are a damping cloth for polishing an infrared aspheric optical part, and a preparation process therefor. The damping cloth for polishing an infrared aspher...
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WO/2024/092170A1 |
A controller of a chemical mechanical polishing system is configured to cause a carrier head to sweep across a polishing pad in accord with a sweep profile. The controller is also configured to select values for a plurality of control pa...
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WO/2024/091508A1 |
The present disclosure includes a method of forming a polished surface. Forming the polished surface can include grinding an initial ceramic substrate to form a ground ceramic substrate; infiltrating the ground ceramic substrate with sil...
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WO/2024/090474A1 |
Provided is a sheet-form polishing article having a long service life, wherein independent air bubbles in a polishing-material layer provided to the sheet-form polishing article ensure a space between a cut material and the surface of th...
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WO/2024/049719A4 |
A fluid delivery system for dispensing slurry directly between a semiconductor wafer and a pad for a chemical mechanical polishing of the semiconductor wafer, the fluid delivery system comprising at least one fluid delivery nozzle affixe...
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WO/2024/091192A1 |
The invention relates an apparatus (A) to ensure that the appropriate drill bit (B) angle and appropriate cutting angle of the micro drill bits (B) with sharpening using at least one sanding element characterized in that; apparatus body ...
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WO/2024/090305A1 |
A tank manufacturing method for manufacturing a tank by joint-welding steel sheets from which the tank is to be configured, the method comprising: a step for performing welding such that a plurality of weld layers are formed successively...
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WO/2024/091709A1 |
A chemical mechanical polishing apparatus has a platen to support a polishing pad, a carrier head comprising a rigid housing and configured to hold a surface of a substrate against the polishing pad, a motor to generate relative motion b...
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WO/2024/089434A1 |
A mandrel (1) for holding an ophthalmic lens member blank (16) during machining is disclosed. The mandrel (1) has a front surface (6) for receiving an ophthalmic lens member blank (16) to be machined. The front surface (6) comprises a pl...
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WO/2024/091314A1 |
A chemical mechanical polishing apparatus has a platen to support a polishing pad, the platen having a recess, a carrier head to hold a surface of a substrate against the polishing pad and comprising a retaining ring to retain the substr...
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WO/2024/089912A1 |
The purpose of the present invention is to provide a device and a method for manufacturing a semiconductor crystal wafer, the device and the method being capable of easily and reliably manufacturing a semiconductor crystal wafer of high ...
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WO/2024/091917A1 |
Disclosed herein are components, systems, and methods of operating an abrasive fluid jet system that recycles and reuses abrasive particles. The systems and methods described enable accurate metering and consistent feeding of wet abrasiv...
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WO/2024/088722A1 |
The invention relates to a method for cleaning plates of a plate heat exchanger, which comprises the following steps: - providing the plates (2) to be cleaned; - supplying dry ice granules; - supplying a cryogenic cleaning device (1) cap...
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WO/2024/084957A1 |
Provided are: a polishing method which can maintain a sufficiently high insulating-film polishing rate and selectivity and can be sufficiently inhibited from causing polishing flaws; and a method for producing a semiconductor component u...
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WO/2024/083622A1 |
The invention relates to a method and a device suitable for eliminating, in particular for removing, annular or helical chips (2, 3) from pin-shaped objects (1). Such chips may remain on the pin (1) for example in a production method inv...
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WO/2024/083932A1 |
The invention relates to components of a changing station for automatically changing abrasive devices (abrasive disks) of a robot-assisted grinding device and to the associated methods for mounting grinding devices to a grinder and for r...
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WO/2024/083536A1 |
The invention relates to a method for grinding a toothing of a workpiece (1) by means of a grinding tool, wherein the grinding tool is mounted on a tool spindle and the tool spindle is turned by means of a first drive motor, and wherein ...
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WO/2024/085217A1 |
This polishing agent composition for a plastic lens contains alumina, a water-soluble polymer compound, and water, wherein the water-soluble polymer compound is an oxazoline group-containing water-soluble polymer compound in which an oxa...
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WO/2024/082358A1 |
The present disclosure relates to the field of semiconductors, and provides a semiconductor structure manufacturing method, and a semiconductor structure. The semiconductor structure manufacturing method comprises: providing a dielectric...
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WO/2024/083517A1 |
The invention relates to a polishing tool (1) for processing technical surfaces, consisting of a polishing main body (1a) and a polishing-means support (1b), wherein: the polishing-means support (1b) has at least one polishing grain; at ...
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WO/2024/083063A1 |
Disclosed in the present invention is a wafer polishing system, at least comprising two polishing units; a single polishing unit comprises at least two polishing modules and a first fixed working position, each polishing module comprisin...
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WO/2024/085218A1 |
This polishing agent composition for a plastic lens contains alumina, polyvinyl alcohol, and water, wherein the degree of saponification of the polyvinyl alcohol is 40-98 mol%, and the degree of polymerization of the polyvinyl alcohol is...
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WO/2024/080081A1 |
A projection polishing system comprises: a shape measurement device (3) that measures a three-dimensional shape and orientation of an object material; a projection detection device (4) that detects a projection that is present on a surfa...
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WO/2024/080189A1 |
Provided is a top ring with which it is possible to improve uniformity of polishing. This top ring for holding a substrate comprises: a base member connected to a rotary shaft; a substrate suctioning member including a porous member ha...
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WO/2024/078567A1 |
Disclosed in the present invention is an eddy-current end-point detection apparatus. The apparatus comprises: a plurality of resonant circuits which are connected in series, wherein each resonant circuit generates a set frequency; a magn...
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WO/2024/081201A1 |
The invention provides a chemical-mechanical polishing composition comprising: (a) a silica abrasive; (b) an oxidizing agent; and (c) water, wherein the chemical-mechanical polishing composition has a pH of about 2 or less. The invention...
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WO/2024/079856A1 |
This communication device (100) comprises: a sensor (S) that is attached to an object (52, T) to be detected and outputs an analog detection signal (SA1); and a modulated laser generation device (103) that generates a modulated laser (SL...
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WO/2024/074763A1 |
A belt sander (500) comprises: - an electric motor (MOTOR1) to cause movement of an abrasive belt (BELT1), - a thermally conductive clamp portion (CLAMP1), which is attached to the motor (MOTOR1) to conduct heat from the motor (MOTOR1), ...
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WO/2024/075284A1 |
This contact dynamic stiffness calculation system (130) calculates contact dynamic stiffness data (Ci, Ki) between a workpiece (W) and a tool (T) exhibited via contact between the workpiece (W) and the tool (T) when machining in a machin...
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WO/2024/075303A1 |
This workpiece mass determination device (131) is for calculating a workpiece mass (M'w(Z')) for analysis for analyzing the dynamic characteristics during machining in a machining device (2) for machining a workpiece (W) by means of a to...
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WO/2024/074631A1 |
The invention relates to a plate grinding/polishing device (10) for surface grinding and/or polishing the sample surface on the lower side of, in particular, embedded and/or non-embedded samples by way of a rotating grinding/polishing pl...
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WO/2024/074951A1 |
The present invention relates to a method for machining small rotary cutting tools (10) by a grinding machine, comprising: a) mounting a workpiece (10a) in a spindle (20) of the grinding machine; b) machining a calibration portion (CP) o...
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WO/2024/076421A1 |
A polishing system includes a pressure system, a substrate carrier including a membrane, a first sensor, and a control system. A first compartment of the membrane is fluidly coupled to the pressure system. The first sensor is configured ...
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WO/2024/074734A1 |
The invention is made up of a set of modules that surround or form a rotation axis of the brush, wherein each of the modules comprises: An annular body (1) carrying a set of bristles (4) of the brush, with an outer surface and an inner s...
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WO/2024/075546A1 |
Provided is a polishing agent, a polishing method, and a method for manufacturing a semiconductor component that exhibit a good polishing speed in CMP of a surface to be polished, said surface including boron-doped silicon. The polishi...
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WO/2024/070832A1 |
The present invention provides a composition for finish polishing, the composition enabling efficient proceeding of etching, thereby being capable of improving the polishing rate, while maintaining the surface quality after the polishing...
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WO/2024/069579A1 |
A method of forming an abrasive article includes providing an abrasive sheet including an abrasive sheet backing and an abrasive layer including a plurality of abrasive particles. The method further includes providing a transfer film inc...
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WO/2024/068135A1 |
The invention relates to a method for roller burnishing workpiece surfaces (10f, 10g, 10h, 18h, 18g, 18i), having the following steps: a) providing a workpiece (7f, 7g, 7h, 7i), b) providing a first roller burnishing tool (1, 1a, 1b, 1c,...
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WO/2024/069386A1 |
A knife (100) and a manufacturing method therefor. The knife (100) comprises: a body portion (10) made of a matrix material or a composite material; and a blade portion (20), which is made of the composite material and joined to the body...
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WO/2024/068231A1 |
The invention relates to a method for producing a pressing tool (1) from a steel sheet (2), wherein the pressing tool (1) is designed for pressing material panels by hot pressing, and wherein the method includes using a machining device ...
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