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WO/2006/119518A1 |
A floor sanding machine (1) has a frame (1) which carries on its underside a motor-driven, vertically adjustable sanding plate (4) with a sanding disk, an annular dust suction nozzle (11) which surrounds the sanding plate, and two front ...
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WO/2006/111790A1 |
The invention concerns a method for manufacturing a semiconductor multilayer wafer having a thin surface layer, a support layer and a buried layer between said surface layer and said support layer, said method being characterized in that...
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WO/2006/112531A1 |
A device for polishing the peripheral edge part of a semiconductor wafer includes a wafer stage for holding the wafer, a wafer stage unit including devices for rotating the wafer stage, causing the wafer stage to undergo a rotary recipro...
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WO/2006/106790A1 |
In a step prior to starting a series of polishing steps of continuously polishing a plurality of polishing objects (semiconductor wafers (W)) by a polishing tool (10), a target shape of a polishing pad (13) is inputted, dressing of the p...
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WO/2006/106710A1 |
In a bonded wafer manufacturing method, at least a bonded wafer is provided by bonding a base wafer to be a supporting substrate with a bond wafer composed of silicon single crystal through an insulating film or directly, the bond wafer ...
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WO/2006/100149A1 |
The invention relates to a method for deep rolling the passes or radii on the transitions between journal and cheeks or flanges of crankshafts by means of a deep rolling device (1) of a deep rolling machine, said deep rolling device havi...
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WO/2006/089291A1 |
Systems and methods for the determination of the end point in a chemical mechanical polishing process are described. The method involves the use of a luminescent indicator that is selectively affected by a material released from a substr...
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WO/2006/077994A1 |
A polishing apparatus is provided for optimizing a polishing profile in consideration of even such parameters as the temperature on the surface of an object to be polished, and the thickness of a polishing pad, in addition to a polished ...
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WO/2006/072456A1 |
The invention relates to a device for highly precise, direct and contactless measurement of the thickness of flat workpieces (5), particularly wafers, during machining of the thickness of said workpiece (5), by means of ultrasound.
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WO2005072332B1 |
A system and method for providing process control in a CMP system utilizes a vacuum-assisted arrangement (15) for conditioning a wafer polishing pad so that the effluent (i.e., wafer debris, polishing slurry, chemical or other by-product...
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WO/2006/061474A1 |
The device comprises: means (5) for automatic measurement of the position-locating characteristics of an ophthalmic lens (L1, L2), means for trimming (6) an ophthalmic lens, including means (613, 612) for tightening said lens; and receiv...
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WO/2006/061910A1 |
A method for setting the initial position of a whetstone before starting grinding in a vertical duplex surface grinding machine for surface grinding the upper and lower grinding surfaces of a work simultaneously by rotation-driving a pai...
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WO/2006/061473A1 |
The method comprises the following stages: automatic measurement of the marking characteristics of the lens in a measurement position in order to produce a marking reference of the ophthalmic lens; transfer of said ophthalmic lens in a s...
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WO/2006/059667A1 |
An on-line grinding method for a work roll capable of reducing an overshoot in which the pressing load of a rotary grinding wheel on the work roll exceeds a set pressing load for grinding, wherein the elastic rotary grinding wheel (3a) i...
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WO/2006/054772A1 |
A manufacturing facility and a super finishing apparatus for ball bearings. The detection part of a matching device (32) is connected to a control means (6) formed of a computer so that detection signals indicating the measured values of...
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WO/2006/051243A1 |
The invention relates to a method for measuring a circular plate (10), wherein the surface (A) of the plate is divided into a plurality (N) of concentric rings having a constant surface (A/H) and at least one measuring point (Pn) is posi...
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WO/2006/053189A1 |
An automatic razor blade sharpener simultaneously sharpens multiple edges of a spring-loaded disposable razor blade cartridge by gently contacting the blade edges with a moving rubber or polymeric compliant belt that is motor driven. The...
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WO/2006/044127A2 |
A method for planarizing a substrate surface (104) having a non-planar surface topography comprises forming a material layer (110) over the substrate (102). The system and method provide for forming a substantially planar layer of materi...
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WO/2006/036412A1 |
Method for process control of electro-processes is provided. In one embodiment, the method includes processing a conductive layer formed on a wafer using a target endpoint, detecting breakthrough of the conductive layer to expose portion...
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WO/2006/035337A1 |
The present invention relates to chemical mechanical planarizing (CMP) and to an apparatus for performing such a CMP process. The method and apparatus according to the invention prevent or at least minimize the time during which a wafer ...
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WO/2006/027885A1 |
Methods for determining and machining the worked surface of a plate-like material and an apparatus for these methods. In the methods, the plate-like material is put on a surface plate, the height of the plate-like material at any flat su...
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WO/2006/025507A1 |
A polishing apparatus and a polishing method. The polishing apparatus capable of accurately chamfering the end face parts of a large-sized substrate is installed on a table unit in which the substrate is placed. The substrate is fixedly ...
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WO/2006/022452A2 |
A polishing apparatus (30) has a polishing surface (32), a top ring (36) for holding a wafer (W), motors (46, 56) to move the polishing surface (32) and the wafer (W) relative to each other at a relative speed, and a vertical movement me...
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WO/2006/022336A1 |
A method of evaluating the error of the cutting edge profile of a re-sharpening pinion cutter provided by performing relieving grinding by a screw motion along the outer diameter relieving angle of the pinion cutter by using a relieving ...
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WO/2006/019840A1 |
Systems and methods control abrading operations of an abrading machine by sensing characteristics of an abrading article installed on the abrading machine. When a problem is discovered by sensing the article, appropriate actions may be t...
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WO/2006/019834A1 |
Systems and methods control abrading operations of an abrading machine by sensing characteristics of an abrading article installed on the abrading machine. When a problem is discovered by sensing the article, appropriate actions may be t...
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WO/2006/020271A1 |
Systems and methods control abrading operations of an abrading machine by sensing characteristics of an abrading article installed on the abrading machine. When a problem is discovered by sensing the article, appropriate actions may be t...
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WO/2006/019713A1 |
Systems and methods control abrading operations of an abrading machine by sensing characteristics of an abrading article installed on the abrading machine. When a problem is discovered by sensing the article, appropriate actions may be t...
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WO/2006/009304A1 |
A polishing apparatus can detect escape of a substrate from a top ring during polishing. The polishing apparatus including: a polishing table (10) having a polishing pad (11); a top ring (21); and a substrate escape detection section for...
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WO/2006/009222A1 |
A detector for detecting the cracking sound of plate glass under polishing while discriminating it from the cracking sound of other plate glass. More specifically, sounds are collected by a microphone (30) and high frequency sounds are e...
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WO/2005/123337A1 |
A technique for in situ monitoring of polishing processes and other material removal processes employs a quartz crystal nanobalance (225) embedded in a wafer carrier. Material removed from the wafer is deposited upon the surface of the c...
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WO/2005/123335A1 |
A polishing apparatus has a polishing table (18) having a polishing surface (40) and a top ring (20) for pressing a substrate against the polishing surface (40) while independently controlling pressing forces applied to a plurality of ar...
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WO/2005/120776A1 |
A material removal optimizing system for a wood surface treating apparatus with a plurality of individual work stations (15, 16, 17,18) arranged serially along an endless conveyor. Each station includes a working abrasive head (27, 28, 2...
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WO/2005/119383A2 |
A method and a relevant apparatus for controlling the machining of a piece (18,38) rotating in a numerical control machine tool (33) includes the steps of detecting instantaneous values (V(i)) indicative of the dimensions of the piece du...
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WO/2005/115689A1 |
A projecting/receiving unit (52) projects a laser light to a peripheral portion (30) and receives the reflected light while a liquid is being fed to a substrate (14) and is flowing on the peripheral portion (30). A signal processing cont...
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WO/2005/113194A1 |
A system for dispensing magnetorheological fluid to an MR finishing machine includes a pump for pressurizing the system; a first magnetic valve for regulating MR fluid flow by magnetically varying the structure and apparent viscosity of ...
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WO/2005/100976A2 |
The present invention presents a novel application of a wavelet-based multiscale method in a nanomachining process chemical mechanical planarization (CMP) of wafer fabrication. The invention involves identification of delamination defect...
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WO/2005/098521A1 |
An automatic suction device for an eyeglass lens and a method for determining suction jig installation position, capable of recognizing that a frame exchange lens holder is being installed on a placement table, making transition to insta...
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WO/2005/097407A1 |
The invention relates to a method for grinding the bearing points and assembled cams of camshafts and for levelling them with the aid of a grinding machine and to a device for carrying out said method, in particular making it possible to...
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WO/2005/092569A1 |
The present invention discloses a method, system and apparatus for use in a roll grinding machine. Data is read from an RFID tag automatically by providing an RF read/write sensor on a movable cylinder rod. The RF sensor is held away fro...
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WO/2005/084886A1 |
The invention relates to a device and method for production of a pre-formed shape on a workpiece having a blank piece shape, by means of grinding in several working steps, preferably on cams (2) of a camshaft (1), comprising a grinding m...
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WO/2005/084261A2 |
A grinder assembly (10) contacts a tire (T) supported by a frame (F) relative to the tire (T). The grinder assembly (10) includes at least one section, and a vertical repositioning system (118) supporting the at least one section. The ve...
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WO/2005/082588A2 |
Improved systems and methods for singulating a substrate into a plurality of integrated circuit devices are disclosed. One aspect of the invention corresponds to a fixture that holds the substrate during the dicing process. Another aspec...
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WO/2005/080048A1 |
The invention relates to a machine tool for machining workpieces, comprising a workpiece holder. Said workpiece holder comprises a support (18), a workpiece spindle head (20) mounted on a first side (27) of the support, and a tailstock. ...
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WO/2005/080059A1 |
A nozzle assembly (314) for directing flow of fluid across one or more semiconductor device cutting blades (318), comprising: one or more nozzles configured to protrude toward a cutting blade for cutting a semiconductor device; and a cha...
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WO/2005/077598A1 |
A detection signal corresponding to a change of the status of an object to be observed can be easily transmitted to a desired location without any complicate installation and adjustment for use. An AE sensor (21) is disposed at an approp...
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WO/2005/072910A1 |
A main sensor (15) measures the distance Lm to the surface of a pad (2a), and a sub-sensor (16) measures the distance Ls to the surface of a reference block (12). The actually used measurement is the value (Lm+Ls). The reference block (1...
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WO/2005/070624A1 |
The invention relates to an electric hand tool (1) comprising an electric motor (8) used to drive a tool (6). The inventive electric hand tool (1) is characterised in that a sensor unit (9) for detecting the contact pressure of the tool ...
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WO/2005/067663A2 |
A method of measuring a change in thickness of a layer of material disposed on a wafer while polishing the layer. Light is directed at the surface of the wafer from an optical sensor disposed within the polishing pad. The intensity of th...
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WO2004111314B1 |
Method and apparatus for process control of electro-processes. The method includes electro-processing a wafer by the application of two or more biases and determining an amount of charge removed as a result of each bias, separately. In o...
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