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WO/2005/061177A1 |
Embodiments of a processing pad assembly for processing a substrate are provided. The processing pad assembly includes an upper layer having a processing surface and an electrode having a top side coupled to the upper layer and a bottom ...
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WO/2005/061178A1 |
A method of polishing a surface (120) of an article, e.g., a semiconductor wafer (112, 212), using a polishing layer (108, 208) in the presence of a polishing medium such as a slurry (116). The method includes selecting the rotational ra...
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WO/2005/059970A2 |
An electropolishing process in integrated circuit fabrication on a wafer includes applying a stream of electrolyte to the wafer using a nozzle positioned adjacent to the wafer with a gap between the nozzle and the wafer. The removal rate...
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WO/2005/046935A1 |
Provided are materials and methods for the chemical mechanical planarization of material layers using a down force of less than about 2.5 psi while maintaining a material removal rate generally similar to that obtained using higher down ...
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WO/2005/044513A1 |
A method for supplying the lens of eyeglasses having a correct finish circumferential length at all times by managing the difference between the circumferential length of lens shape of the frame and the circumferential length of a proces...
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WO/2005/043132A1 |
A system method and apparatus to monitor a frictional coefficient of a substrate undergoing polishing is described. A polishing pad assembly includes a polishing layer including a polishing surface, and a substrate contacting member flex...
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WO/2005/035191A1 |
A chemical mechanical planarization (CMP) system is provided. The CMP system includes a wafer carrier (154) configured to support a wafer (148) during a planarization process, the wafer carrier including a sensor (144) configured to dete...
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WO/2005/035188A1 |
The inventive grinding machine consists of a control unit (39), a frame (18) and devices which are mounted on said frame and comprise a support provided with fixing means for carrying a part (34) for finishing and a processing group (20)...
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WO/2005/030437A1 |
The invention relates to a grinding machine tool comprising a machine control device which initially determines the wobbling of a blank (7) in relation to the ideal receiving axis (C) of tool receiving element by means of a suitable meas...
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WO/2005/025804A1 |
A polished state monitoring apparatus capable of easily grasping the progress of polish is provided. The polished state monitoring apparatus monitors the progress of polish of a surface to be polished by obtaining a characteristic value ...
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WO/2005/018876A1 |
The invention relates to a control unit (23) for a grinding device, which winds and unwinds the grinding means carrier (16) by means of a contact apparatus (12). Said control unit (23) continuously detects the position of one or more of ...
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WO/2005/016595A1 |
In a grinding apparatus (1), a grinding member (40) is vertically movably installed on a head housing (31) by using a drive plate (10). The grinding apparatus (1) has a strain gauge (92) capable of detecting a deformation amount of the d...
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WO/2005/012195A2 |
The present invention is directed to an apparatus (10) for grinding or polishing at least one edge of a glass substrate. The apparatus includes an air bearing support member (20) configured to pivot about an axis of rotation (12) with ze...
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WO/2005/007342A1 |
Disclosed is a top ring for holding a semiconductor wafer used in a polishing apparatus for semiconductor wafers. The top ring comprises a retainer ring for holding the peripheral edge of an object to be polished and a generally disk-lik...
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WO/2005/004218A1 |
A polishing apparatus has a polishing section (302) configured to polish a substrate and a measurement section (307) configured to measure a thickness of a film formed on the substrate. The polishing apparatus also has an interface (310)...
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WO/2004/113021A1 |
Methods and apparatus to implement techniques for monitoring polishing a substrate. Two or more data points are acquired, where each data point has a value affected by features inside a sensing region of a sensor and corresponds to a rel...
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WO/2004/113020A1 |
The present invention relates to a substrate polishing apparatus and a substrate polishing method for polishing a substrate such as a semiconductor wafer to a flat finish. The substrate polishing apparatus includes a polishing table (100...
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WO/2004/112093A2 |
A variety of techniques may be employed, alone or in combination, to enhance contact between a processed substrate and applied megasonic energy. In accordance with one embodiment of the new invention, the vibration plate is brought into ...
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WO/2004/110700A1 |
The invention relates to a method and a device for the automated treatment of spectacle lenses. A raw glass (22) is treated in a treatment center (10) in accordance with defined first data of the raw glass (22) and second data of a perta...
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WO/2004/109758A2 |
A wafer carrier with a back pressure applicator system adapted to provide high resolution back pressure control. A plurality of millimeter scale distensible elements (42, 43, 44, 45, 46) are disposed between the wafer carrier pressure pl...
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WO2004014603B1 |
Polishing pads with a window, systems containing such polishing pads, and processes that use such polishing pads are disclosed. For example, a light beam (34) having a wavelength between about 300 and 500 nm may be directed through a tra...
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WO/2004/106000A1 |
In a system and a method, according to the present invention, a sensor signal, such as a motor current signal, from a drive assembly of a pad conditioning system is used to estimate the status of one or more consumables (113) in a CMP sy...
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WO/2004/105998A1 |
The invention relates to a floor sanding machine, comprising a frame and height-adjustable sanding plate, mounted on the above, beneath the same, for retaining a sanding disc, driven by a motor together with a vacuum turbine, with an ann...
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WO/2004/103637A1 |
The invention relates to a method and a device for machining spectacle lenses using a computer numeric controlled (CNC) spectacle-lens grinding machine. Said device comprises a spectacle lens securing shaft (5, 6, 19) that secures the sp...
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WO/2004/103636A2 |
A substrate polishing apparatus (10) polishes a substrate (20) to a flat mirror finish. The substrate polishing apparatus (10) has a polishing table (12) against which a substrate (20) is pressed, a light-emitting and light-receiving dev...
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WO/2004/105112A1 |
A substrate holding apparatus holds a substrate such as a semiconductor and presses the substrate against a polishing surface. The substrate holding apparatus includes a top ring body (2) for holding the substrate, a plurality of fluid p...
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WO/2004/102290A1 |
A numeric controller capable of performing chopping control machining without providing an additional axis dedicated to chopping and provided, at the interpolating section (12) and the axis controlling section (13), with a movement data ...
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WO/2004/101223A1 |
A substrate polishing apparatus polishes a surface of a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus according to the present invention has a rotatable table (12) having a polishing p...
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WO/2004/098829A2 |
Systems (100) and methods for polishing microfeature workpieces (112). In one embodiment, a method includes determining a status of a characteristic of a microfeature workpiece (112) and moving a carrier head (130) and/or a polishing pad...
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WO/2004/094105A1 |
A vacuum suction holding apparatus has a vacuum tube passage (50) provided inside a grinding head (40). One end side of the passage (50) is open at an installation surface (42a) and the other side is connected to a vacuum source (60). A ...
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WO/2004/091856A2 |
A grinding assembly for shaping work pieces that includes one or more grind spindles. Each of the grind spindles include two independent grinding wheels driven by a single spindle drive. The grind spindles translate horizontally to perfo...
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WO/2004/091857A1 |
The invention relates to a device for cleaning and/or deburring workpieces, especially cast parts, comprising a machining device (3) having at least one tool for removing superfluous material. The inventive device is characterized by a m...
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WO/2004/090502A2 |
System (100) of and method (800) for capturing a plurality of one-dimensional images representative of substantially all of the surface of a substrate (180) within a single revolution of a rotating platen (120) holding a polishing pad (1...
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WO/2004/087372A1 |
A finishing method and a finishing device capable of accurately finishing a work in a complicated shape, the method comprising the steps of elastically deforming a jig (160) having a work (W) together with the work, pressurizing the work...
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WO/2004/087371A1 |
A machining method and a machining device capable of accurately machining a work in a complicated shape and suitable for forming the curved shapes and machining the surfaces of optical elements such as free-form surface mirrors and lense...
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WO/2004/087375A1 |
A polishing (102) pad for chemical mechanical planarization of a film on a substrate is customized by obtaining one or more characteristics of a structure on a substrate. For example, when the structure is a chip formed on a semiconducto...
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WO/2004/078411A2 |
A method and apparatus for local polishing and deposition control in a process cell is generally provided. In one embodiment, an apparatus for electrochemically processing a substrate is provided that selectively polishes discrete conduc...
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WO2004027837B1 |
A substrate holder has a disk-like body with a central recess having diameter smaller than the diameter of the substrate placed onto the upper surface of the holder. The substrate can be clamped in place by the clamps of the edge-grip me...
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WO/2004/071750A2 |
The invention relates to a method for retreading worn-down tires (12), especially tires that have become out of true during use, especially aircraft tires. According to this method, the remaining tire tread material is equidistantly buff...
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WO/2004/070806A1 |
The present invention relates to a substrate holding apparatus for holding a substrate (W) such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. A substrate holding apparatus comprises a ver...
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WO/2004/069477A1 |
In general, techniques are described that allow an abrasive manufacturing process to achieve a controlled performance parameter, e.g., an amount of material removal, without requiring the use of feedback controls within the abrasive manu...
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WO/2004/069471A2 |
The invention relates to a method for calibrating a grinding machine for sharpening bar blades (10) by grinding at least two flanks (5, 6) and a top surface (K) of the bar blades (10), involving the following steps: producing a calibrati...
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WO/2004/067228A1 |
The aim of the invention is to machine the surface of objects using a universal device, as economically as possible and in a significantly reduced amount of time, even in the event of process variations, material non-homogeneities etc., ...
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WO/2004/060610A2 |
A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing the amount of heat generated during polishing of a substrate to be polished and of effectively cooling t...
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WO/2004/060609A1 |
Specific embodiments of the present invention are directed to a method of operating a modular chemical mechanical planarization process. The method comprises operating CMP apparatus comprising a docking station having at least one CMP mo...
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WO/2004/060611A1 |
A method of monitoring the wear of a grinding wheel (10) comprises the steps of measuring the force exerted between the wheel and a workpiece (26), measured normal to the grinding face of the wheel at the point of contact between the whe...
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WO/2004/058452A2 |
The invention relates to an apparatus for forming or working optical elements and/or optical forming elements (1) comprising a working apparatus (18) for forming surfaces of form parts by machining or an abrasive technique, wherein at le...
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WO/2004/058449A2 |
A computer controlled all-in-one reel mower sharpener and roller alignment system can be rolled under a mower to be conditioned. No removal of the cutting unit id needed. A linear voltage displacement transducer (LVDT 715 or a mechanical...
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WO/2004/056531A1 |
Disclosed is a finishing machine tool, and more particularly, to a head unit structure in a finishing machine tool in which a grinding bit can perform a finishing work at a uniform pressure by an automated static pressure unit and an ope...
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WO/2004/053942A2 |
An apparatus for electropolishing and/or electroplating metal layers on a semiconductor wafer includes a receptacle having a plurality of section walls (figure 1). The apparatus includes a wafer chuck configured to hold the semiconductor...
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