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WO/2004/050301A2 |
A method of finishing like castings wherein the exact dimensions of the casting (13) are not known requires the steps of traversing the casting along a fixed path impinging excess material (14) on a reduction apparatus such as grinder at...
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WO/2004/049417A1 |
A polishing pad enabling a highly precise optical endpoint sensing during the polishing process and thus having excellent polishing characteristics (such as surface uniformity and in-plain uniformity) is disclosed. A polishing pad enabli...
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WO/2004/048030A1 |
The invention concerns a measuring method applicable to a machine-tool (M) which consists in causing the tool (O) to contact a point selected as reference in the machining station by controlling said actuating means (200) which, through ...
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WO/2004/048035A1 |
In grinding the outer peripheral surface of work (10) in the form of a non-circular rotary body, while being rotated around its axis, by a rotary grindstone (22) adapted to be advanced and retracted by NC control according to the profile...
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WO/2004/048038A1 |
A CMP station can be closed loop controlled by using data obtained by an inline metrology station (323) from a first polished wafer to affect the processing of subsequent polished wafers. The first wafer is polished and measured by the i...
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WO/2004/043647A1 |
An apparatus (10) for wafer grinding includes sensors (38) and a spectral analyzer to perform a spectral analysis of light received by the sensors (38) during grinding of a semiconductor wafer (12). Based on the spectral analysis, the gr...
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WO/2004/041479A1 |
A polishing apparatus has a polishing table (12) with a polishing surface (10) attached thereon, and a top ring (20) for pressing a workpiece (W) against the polishing surface (10). The top ring (20) has a housing (40) and a retainerring...
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WO/2004/039538A1 |
A method and a device for machining a glass pane capable of continuously grinding the peripheral edges of sequentially transferred glass panes to a specified shape even if a grinding wheel is worn and increasing an efficiency for manufac...
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WO/2004/037490A1 |
The invention is directed to a chemical-mechanical polishing pad substrate comprising a porous material having an average pore size of 0.01 microns to 1 micron. The polishing pad substrate has a light transmittance of 10% or more at leas...
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WO/2004/037491A2 |
A sharpening apparatus with substantially rigid sharpening wheels disposed substantially fixedly on a rotatable drive shaft. An edge of a blade inserted in a slot in the apparatus comes into contact with a sharpening surface on a sharpen...
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WO/2004/035265A1 |
A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit ...
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WO/2004/033148A1 |
A both side grinding technology for obtaining a work exhibiting excellent parallelism and flatness by detecting disorder in the attitude of a grinding wheel from the amount of deformation of a ground work. When cutting of grinding wheels...
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WO/2004/030866A1 |
When a control device (102) makes a decision that a decrease in tangential grinding resistance has occurred, sets the degree of opening of a flow control valve (4) to a small value, and makes a decision that the processing is at a predet...
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WO/2004/030865A1 |
A linear chemical mechanical planarization (CMP) system includes a belt pad (102), a slurry bar (120) having a plurality of nozzles, and a heating module (130) for heating slurry. The heating module (130) has a plurality of heating eleme...
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WO/2004/027411A1 |
A system and method of measuring a metallic layer on a substrate within a multi-step substrate process includes modifying a metallic layer on the substrate such as forming a metallic layer or removing at least a portion of the metallic l...
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WO/2004/024392A1 |
The present invention provides a system and method for measuring the surface properties of polishing pads using non-contact ultrasonic reflectance. An ultrasonic probe (15) is located over the polishing surface (120) and configured to bo...
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WO/2004/024393A1 |
The present invention provides, polishing pad (230) with improved polishing properties and longevity. The pad is comprised of a thermoplastic foam substrate (240) having a surface (242) comprised of concave cells (244). A polishing agent...
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WO/2004/024394A1 |
Aspects of the invention generally provide a method and apparatus for polishing a substrate using electrochemical deposition techniques. In one aspect, an apparatus for polishing a substrate (104) comprises a counter-electrode (166) and ...
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WO/2004/020147A1 |
The invention relates to a grinding device (10) for grinding bodies, particularly ferrules of optical plug connectors, comprising a device (31) for holding the bodies to be ground. This device can be pressed along an axis (34) with a pre...
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WO2002053320A9 |
The present invention provides an improved planarization apparatus for chemical mechanical planarization. In an exemplary embodiment, the invention provides an apparatus having a back support (118) operatively coupled to the edge support...
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WO/2004/012249A1 |
A polishing device, wherein an instruction is given from a calculation means (4) to a control device (5) when a load cell (3) is held by a polishing head (1) and a polishing surface plate (2) to feed a specified voltage to an electropneu...
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WO/2004/009291A1 |
A polishing pad has a polishing layer (22) with a polishing surface (24) and a back surface. A plurality of grooves (28b) are formed on the polishing surface, and an indentation (52) is formed in the back surface of the polishing layer. ...
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WO/2004/002680A1 |
A method for monitoring a polishing condition of a surface of a wafer in a polishing process is provided, the method comprising the steps of providing a wafer (16) to be polished, the wafer (16) having at least one optically distinguisha...
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WO/2004/002681A1 |
The thickness of an abrasive pad (311c) used for polishing a wafer (Wd) is measured by a pad thickness measuring device (319). When the thickness is less than a predetermined value, the abrasive pad (311c) is judged that its life is over...
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WO/2003/106108A1 |
An apparatus for checking diameter and roundness of crankpins (42) in the course of the machining in a grinding machine, includes a Vee-shaped reference device (70), a gauging device with a movable feeler (67) associated with the Vee-sha...
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WO/2003/103898A1 |
A light beam from a white light source (404) is reflected from a white diffusing reflective plate (403) and diffused to illuminate substantially the whole surface to be polished of a wafer (Wm) chucked by a chuck substantially uniformly....
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WO/2003/099516A1 |
The invention relates to a method for producing thin, plate-like elements having plane-parallel plane surfaces and a predetermined thickness which are produced by lapping or polishing of at least one of the plane surfaces. According to t...
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WO/2003/097300A1 |
A polishing pad (3) having an optical assembly (25) that does not cause excess wear on wafer workpiece. The optical assembly (25) is disposed within the pad (3) such that it may move in response to forces applied to the optical assembly ...
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WO/2003/096124A1 |
The invention relates to a method for producing an optical blank (1) consisting of a crystalline material, as a preliminary stage for the production of a lens or a lens element for an objective, especially a projection objective for a mi...
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WO/2003/082521A1 |
A temperature controlling system for use in a chemical mechanical planarization (CMP) system having a linear polishing belt (102), a carrier (108) capable of applying a substrate (104) over a preparation location over the linear polishin...
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WO/2003/083522A2 |
A system and method for detecting an endpoint during a chemical mechanical polishing process is disclosed that includes illuminating a first portion of a surface of a wafer (300) with a first broad beam of light (132). A first reflected ...
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WO/2003/082522A1 |
In chemical mechanical polishing apparatus, a wafer carrier plate is provided with a cavity for reception of a sensor positioned very close to a wafer to be polished. Energy resulting from contact between a polishing pad and an exposed s...
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WO/2003/080292A1 |
The invention relates to a machine (1) for grinding the blades of a turbine rotor (2) or a compressor. The inventive machine consists of a rotary head (6) which is provided with two different grinding wheels (7, 7') for grinding the roto...
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WO/2003/080291A2 |
The polisher (10) includes a polishing unit (12), a processor (14), a porting device (16) for a portable memory device (18), and multiple input devices (15). The polishing unit (12) is comprised of a pneumatic arm assembly and a platen a...
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WO/2003/080290A1 |
An apparatus (10) for polishing an edge of an automotive glass sheet (12) comprising a retaining device (16), which is capable of supporting the automotive glass sheet (12), and a polishing wheel assembly (20). A motor assembly (26) is c...
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WO/2003/078535A1 |
The present invention is directed, in general, to a method of planarizing a surface on a semiconductor wafer and, more specifically, to a method of altering the properties of polishing pads to improve thermal management during chemical-m...
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WO/2003/078104A1 |
In step (S11), amounts (parameters) to be varied are respectively varied by a predetermined pitch and standard treatment conditions are decided by combining the parameters. For each of the standard treatment conditions, treatment is perf...
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WO/2003/078098A1 |
The device (1) is used for machining the flanks (91, 92) of cutting tools (9), especially saw blades. The saw blade (9) is clamped in clamping jaws (2). The flank (91) of the saw blade is surface-grinded with the aid of a grinding disk w...
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WO/2003/079428A1 |
A method of polishing a plurality of layers on a surface of a semiconductor wafer includes polishing a first layer such as copper using a polishing solution on a first portion of polishing pad and polishing another layer as a barrier lay...
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WO/2003/077309A2 |
A method for estimating the likely waviness of a wafer after polishing based upon an accurate measurement of the waviness of the wafer in an as-cut condition, before polishing. The method measures the thickness profile of an upper and lo...
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WO/2003/076134A1 |
Methods and apparatuses for electrochemical-mechanical processing of microelectronic workpieces.One embodiment of an electrochemical processing apparatus (100) in accordance with the invention comprises a workpiece holder (120) configure...
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WO/2003/074228A1 |
An apparatus for polishing a workpiece includes a workpiece holder (104) configured to hold the workpiece, a polishing member (102) configured to be positioned adjacent to a face of the workpiece in order to polish the workpiece face wit...
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WO2002060643A9 |
The present invention provides an improved planarization or polishing apparatus for chemical mechanical planarization and other types of polishing such as metal polishing and optical polishing. In an exemplary embodiment, an apparatus fo...
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WO/2003/072306A1 |
A polishing apparatus 110 which comprises a polishing tool 1 having a polishing surface, and a holder means (top ring 4) for holding a semiconductor wafer (a substrate) W. Polishing apparatus 110 further comprises color CCD camera 10 for...
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WO/2003/072305A1 |
A method and a controller 150 for the chemical mechanical polishing (CMP) of substrates 121 and, in particular, for the chemical mechanical polishing of metallization layers is disclosed. In a linear model of the CMP process, the erosion...
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WO/2003/073051A1 |
An acoustic sensor for monitoring machining processes in machining tools, e.g. grinding machines, includes a stationary unit, or stator (21) and a rotating unit, or rotor (23), the latter being coupled, for instance, to the grinding whee...
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WO/2003/070427A2 |
The invention relates to a method for re-grinding and polishing free-form surfaces, especially rotationally symmetrical aspherical optical lenses by tools. According to the inventive method, the virtual levelling of a coarsely pre-grinde...
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WO/2003/071592A1 |
A method for polishing wherein an article is polished by the thrust thereof on fixed abrasive grains with sliding, characterized in that it comprises a first step of polishing the article to be polished while feeding a polishing fluid wh...
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WO/2003/071593A1 |
A method for polishing wherein an article is polished by the thrust thereof on fixed abrasive grains with sliding, characterized in that it comprises a first step of polishing the article to be polished while feeding a polishing fluid wh...
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WO/2003/066284A1 |
A polishing system (20) can have a rotatable platen (24), a polishing pad (30) secured to the platen, a carrier head (10) to hold a substrate against the polishing pad, and an eddy current monitoring system including a coil or ferromagne...
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