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WO/2001/068521A2 |
A functionalized diamond comprises an organic functionalized moiety. The organic functionalized moiety being selected from: vinyl,amide, alcohol, acidics, phenolics, hydroxyls, carboxyl, aldehyde, and aliphatics, and combinations thereof.
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WO/2001/066307A2 |
Method and apparatus for shaping the edge (103) of a rigid, brittle materials such as ceramic plates and rigid composite plates utilizing a resin-bonded abrasive wheel.
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WO/2001/064396A1 |
A polishing pad (18) is made by a piezoelectric delivery system (13), and a method of making the pad includes, building successive layers of droplets of material one layer on another layer by dispensing the material in fluid phase as dro...
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WO/2001/064399A1 |
A grinding wheel comprising an inner and outer area. The outer area is made of an abrasive grain in a ceramic bonding and is porous, in addition to having a lower density than the inner area. The inner area (1) is also embodied as an abr...
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WO/2001/062442A1 |
Described are abrasive articles comprising a nonwoven; a binder layer contacting the nonwoven and at least partially filling spaces between fibers of the nonwoven; first abrasive particles adhered to the binder layer; a slurry layer comp...
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WO/2001/056745A1 |
The invention relates to sintered metal bonded segments (Sm) with an abrasive action, and containing particles of hard material, for tools for machining or cutting hard and/or brittle materials with a tool support (W)which accommodates t...
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WO/2001/056739A1 |
A grinding pin (53) for grinding notches in the edges of disc workpieces, such as semi-conductor wafers, comprises a metal spindle (132) for mounting in a grinding machine, and an adjoining cylindrical region having axially spaced sectio...
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WO/2001/056947A1 |
Fused abrasive particles comprising alumina (151)-aluminium ytrium oxide (153) composite eutectic material (150). The fused abrasive particles can be incorporated into abrasive products such as coated abrasives, bonded abrasives, non-wov...
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WO/2001/056946A1 |
Fused abrasive particles comprising aluminium oxide (151) -aluminium rare (153) eutetic material (150). The fused abrasive particles can be incorporated into abrasive products such as coated abrasives, bonded abrasives, non-woven abrasiv...
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WO/2001/056948A1 |
Fused abrasive particles comprising eutetic material comprising aluminium magnesium oxide (151) - aluminium rare earth oxide (153) eutetic (150). The fused abrasive particles can be incorporated into abrasive products such as coated abra...
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WO/2001/056945A1 |
Fused abrasive particles comprising eutetic material comprising aluminium magnesium oxide (151) - aluminium ytrium oxide (153) eutetic (150). The fused abrasive particles can be incorporated into abrasive products such as coated abrasive...
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WO/2001/056950A1 |
Fused abrasive particles comprising aluminium oxide (151) -aluminium metal oxide (153) eutectic colonies (150). The fused abrasive particles can be incorporated into abrasive products such as coated abrasives, bonded abrasives, non-woven...
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WO/2001/056949A1 |
Fused abrasive particles comprising at least one alumina (151) -metal oxide (153) euleclic (150). The fused abrasive particles can be incorporated into abrasive products such as coated abrasives, bonded abrasives, non-woven abrasives, an...
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WO/2001/053042A1 |
A multi-layered polishing pad (30) for modifying a surface of a workpiece, such as a semiconductor wafer. The polishing pad (30) includes a polishing layer (31), at least one sub-pad layer (36) adjacent the polishing layer (31), and an a...
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WO/2001/053040A1 |
A polishing pad includes a flexible substrate (5) and a polymeric polishing layer (11) that has a repeatable pattern of polymeric asperities that are manufactured by printing, according to a gravure printing process or a screen printing ...
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WO/2001/049457A1 |
Production of a finished fabric backing for use in the production of a coated abrasive is performed using a dual cure system comprising a radiation curable binder and a thermal initiator in which polymerization is initiated by the use of...
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WO/2001/048752A1 |
A process for mirror-finishing the edge of a recording disk raw plate comprising (a) grinding the edge of a recording disk raw plate with a diamond wheel to shape the edge into a trapezoidal configuration; (b) grinding the edge of the re...
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WO/2001/045900A1 |
A polishing pad having a soft layer with a porous structure impregnated with a relatively hard material that locally deforms irreversibly under polishing pressures to a substantially flat polishing pad surface. The polishing pad comprise...
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WO/2001/045903A1 |
To provide an abrasive material which is excellent in loading resistance and durability, allows no attachments to attach to an abraded surface even when the end surface of the optical fiber is abraded, and is particularly suited for use ...
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WO/2001/045899A1 |
A polishing pad has a structure capable of supplying water to the plane of contact with a workpiece, especially a domain structure with an area of less 1 $m(x) 10?-6¿ m. The pad is suitable for semiconductor applications because it is u...
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WO/2001/045904A1 |
Coated abrasives comprising shaped structures deposited on a backing can be given increased versatility by varying the composition comprising the structure such that different characteristics are revealed as the structure is eroded durin...
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WO/2001/043919A1 |
The present invention relates to abrasive articles having an abrasive coating comprised of a binder, abrasive particles having a Mohs' hardness of 7 or greater and non-abrasive particles having a Mohs' hardness less than about 6, wherein...
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WO/2001/043920A1 |
Manufacture of a polishing pad (300) for polishing a semiconductor substrate, involves, transporting a backing layer (302) to successive manufacturing stations, supplying a fluid phase polymer composition onto the transported backing lay...
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WO/2001/041975A1 |
A resilient flexible sanding sponge (20) including a foam backing layer (22) having a layer of abrasive particles (26) distributed along one of its major surfaces (24) that are adhered together and to the backing layer by a layer of flex...
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WO/2001/040138A1 |
A porous silicon carbide sintered compact which comprises a structure being composed of silicon carbide crystals (21, 22) and having open pores (23) present therein, wherein the carbide crystals have an average particle diameter of 20 $g...
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WO/2001/036160A2 |
The invention relates to a consumable rotating disc for finishing material surfaces. A material finishing layer is fixed using binding means to a bearing surface on a front face of a disc-shaped base body which is used with the rotating ...
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WO/2001/034348A1 |
An abrasive implement has a supporting member (1) with a central hub (2) mounting for use in connecting the member to a tool and an annular abrasive (4) support region surrounding the central hub. The supporting member is formed from an ...
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WO2000030808A9 |
A method for making a sintered article (14) comprising providing a plurality of individual blocks (19) of sinterable matrix material, arranging said blocks in abutting relationship to form an assembly of said blocks in a sinter mold wher...
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WO/2001/032364A1 |
The invention provides individually made abrasive discs with the primary abrasive surface around the periphery of the disc where the bulk of the abrading action occurs when the disc is in use. The invention also provides a process by whi...
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WO/2001/030935A1 |
The invention relates to an abrasive grain based on aluminum oxide, silicon carbide, cubic boron nitride and or diamond comprising a coating of an inorganic or organic binder wherein said coating contains abrasive filling material. The i...
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WO/2001/028741A1 |
The present invention provides a flexible abrasive article comprising abrasive particles adhered to a foraminous substrate with at least one binder wherein the abrasive article comprises less than 300 ppb of selected extractable cation p...
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WO/2001/029145A1 |
Abrasive materials comprising silica-coated transitional alumina particles with an average particle size of less than 50 nanometers and a BET surface area of at least 50 m2/gm are useful in CMP processes either in the form of slurries or...
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WO/2001/027215A1 |
Fine abrasive powders can be made more free-flowing and better adapted to UP deposition in the production of coated abrasives by the control of the volume resistivity of the powder to a level that is not greater than 10?14¿ ohms.cm by i...
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WO/2001/026862A1 |
A conditioner for polishing pad and a method for manufacturing the same are disclosed. The conditioner comprises a substrate having formed with a plurality of geometrical protrusions of a uniformed height on at least one of its sides, an...
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WO/2001/024970A1 |
An abrasive material comprises an integral mass of discrete lengths, not bonded to each other, of abrasive-coated non-woven synthetic fibres. In particular, the entanglement force between the said lengths is great enough to maintain a wa...
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WO/2001/024971A1 |
This invention encompasses abrasive articles that have a coating, typically made of at least a binder and abrasive particles, selectively removed from a portion of an exposed abrading surface of the article in order to inscribe a detecta...
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WO/2001/023321A1 |
Alpha alumina-based abrasive grain. The abrasive grain can be incorporated into abrasive products such as coated abrasives, bonded abrasives, non-woven abrasives, and abrasive brushes.
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WO/2001/023323A1 |
Alpha alumina-based abrasive grain and method of making the same. The abrasive grain can be incorporated into abrasive products such as coated abrasives, bonded abrasives, non-woven abrasives, and abrasive brushes.
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WO/2001/023139A1 |
A polishing pad is treated for surface conditioning by exposing a polishing surface on the pad to a chemical solvent having a solubility parameter that differs by less than about twenty percent from a solubility parameter of the material...
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WO/2001/023630A1 |
A fused metal matrix abrasive body and method of preparing a fused metal matrix abrasive body is provided. The fused metal matrix abrasive body comprises a plurality of metal coated abrasive particles and a fused metal matrix comprising ...
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WO/2001/019938A1 |
Abrasive composition for the manufacture of tools for the execution of surface treatments on stone and ceramic materials, comprising a superabrasive and a binder comprising a frit approximately melting between 450°C and 650°C and a ref...
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WO/2001/017725A1 |
A polishing pad for polishing the surface of a work, characterized in that (A) it comprises a resin formed by the ring-opening metathesis polymerization of a cycloolefin, and (B) the resin has a heat distortion temperature of 90 to 135°...
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WO/2001/015860A1 |
A polishing cloth is used to polish a semiconductor wafer, particularly to give a mirror finish, without causing damage to the wafer surface. The polishing cloth has a zinc compound content of less than 200 ppm in terms of the weight of ...
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WO/2001/015856A1 |
Polishing pads (140), planarizing machines (100) and methods for mechanical and/or chemical-mechanical planarization of semiconductor wafers (12), or microelectronic substrate assemblies. A web-format machine comprising a planarizing tab...
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WO/2001/014494A1 |
The invention concerns sintered bauxite or alumina abrasive grains wherein the surface/volume ratio is greater that 2 mm?-1¿ and which have a prismatic shape truncated by two surfaces, for example planar surfaces substantially perpendic...
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WO/2001/014495A1 |
Coating a sol-gel alumina abrasive grit with a ceramic oxide reduces the surface area of the grit and allows the production of vitreous bonded products using low temperature vitreous bond materials without the production of black spots a...
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WO/2001/012387A1 |
A polishing pad (10) is formed as a one-piece article having a region (12) which is transparent and an adjacent region (14) which is opaque. The article (10) is formed by solidifying a flowable polymeric material which at least initially...
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WO/2001/010974A1 |
Abrasive grain with increased projectability in an UP deposition process is provided with a first conductive coating and a second coating comprising a silicon-containing compound.
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WO/2001/008848A1 |
A microabrasive tool is formed from a slurry including liquid, abrasive grains, a bonding material, and a polymer (22) for example, gellan gum. The slurry is cast in a mold, and the polymer is ionically cross-linked. Cross-linking the po...
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WO/2001/004227A2 |
An abrasive article (40) is provided comprising a rigid backing (42) having a first major surface (44) and a second major surface (46); a plurality of ceramic abrasive composites (50) each comprising a plurality of abrasive particles (51...
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