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WO/2007/037096A1 |
Provided is a method for manufacturing a (110) silicon wafer by slicing a silicon single crystal ingot having plane orientation (110) by using a wire saw. The method for manufacturing the (110) silicon wafer is characterized in that the ...
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WO/2007/036784A1 |
The sawing machine according to the invention comprises a double portal structure (11) with two pairs of uprights (11.1), along which slides a respective ram (13). The rams (13) bear four support shafts (15), superposed in pairs and each...
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WO/2007/036845A1 |
The present invention finds application in the processing of stones and the like and particularly relates to a machine tool for surface processing of slabs or products having a flat surface of stone material or the like, which machine co...
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WO/2007/037118A1 |
A laser cutting device for a brittle material capable of realizing the high quality and high speed cutting of a substrate formed of the brittle material to be cut irrespective of the size of the substrate to be cut. In the laser cutting ...
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WO/2007/035097A2 |
The invention relates to a method for separating electronic components, comprising the processing steps of placing an assembly of electronic components on a manipulator, transporting the electronic components with the manipulator along a...
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WO/2007/032392A1 |
A laser processing method in which the sectional shape at a focusing point P of a laser beam L is such that a maximum length in a direction perpendicular to a scheduled cutting line (5) is shorter than a maximum length in a direction par...
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WO/2007/032346A1 |
A cutter (51) is composed of a disc-shaped cutting blade (22) having a through hole (21) at the center; an annular piezoelectric vibrator (25), which is concentrically fixed with the blade (22), in a region inside an outer circumference ...
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WO/2007/028359A1 |
The invention relates to a method and device for processing workpieces (1), which are made of glass or glass ceramics, with tools (4, 5) having a special geometric blade. To this end, the material of the workpiece (1) is first softened i...
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WO/2007/026512A1 |
Disclosed are a wire saw device; and a method of improving a nanotopography on the surface of a wafer formed by cutting an ingot by a wire saw device. The method improves the straightness of the feeding of a work feed table installed in ...
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WO/2007/021193A1 |
Method and system for controlling a wire tension system for a diamond wire saw in a diamond wire machine, comprising monitoring the cylinder extension (CE) as a measure of the wire extension and comparing the wire extension with the maxi...
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WO/2007/020414A1 |
An apparatus for splitting stones and blocks comprises means (5A, 6A) for supporting a stone or block while it is subject to a splitting operation, a unit which includes an upper blade (1) for engaging an upper surface of the stone or bl...
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WO/2007/020822A1 |
A laser processing method in which particles are prevented from being generated from the cutting surface of a chip obtained by cutting a silicon wafer. Irradiation conditions of laser light (L) for forming modified regions (77-712) are a...
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WO/2007/020835A1 |
A system for brittle material cutting process is provided to perform high quality and high speed cutting process to a brittle material substrate to be processed, irrespective of sizes of the substrate to be processed. A substrate holder ...
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WO/2007/017569A1 |
An ophthalmic lens milling and boring device comprising supporting means for clamping and rotating the lens about an axis of rotation, means for milling the lens in the supporting means, and means for boring the lens in the supporting me...
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WO/2007/017870A2 |
A machine for shaping blanks to create a lens, the machine comprising a pair of worktables, driven by a first motor, and supporting blanks to be shaped; a drill bit unit with a rotatable drill bit; an elevator, driven by a second motor, ...
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WO2006133565B1 |
The invention relates to apparatuses, combinations and methods for exposing corners of artificial stones to an ageing device. The corner-exposing apparatus includes a platform for supporting the stone and exposing the same to the abrasiv...
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WO/2007/012717A1 |
The inventive machine (11) comprises a lens support (19), a tool holding assembly (21) provided with a rotatable drilling tool (39) and means (25) for controlling the drilling tool (39) position with respect to the support (19) comprisin...
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WO/2007/009436A1 |
Thin natural stone slabs (1), which are glued to a support (2, 3), can be produced by sawing thick natural stone slabs with the aid of a splitting machine (4).
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WO/2007/010810A1 |
A laser processing apparatus (1001) is provided with a laser generating section (101) for generating a laser beam (301), and a driving section (105) for relatively shifting the laser beam (301) to a subject (106) to be processed and irra...
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WO/2007/010177A1 |
There is provided a cutting tool (100; 200; 300) which is capable of performing cutting operations on a variety of materials such as, for example, plasterboard, glass, wood, laminated wood, cardboard, Perspex (Trade Mark), tiles, plastic...
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WO/2007/004890A1 |
The present invention is related to a method for reducing attraction forces between wafers (4). This method is characterized in that it comprises the step of, after sawing and before dissolution of the adhesive (5), introducing spacers (...
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WO/2007/004700A1 |
A scribing wheel is composed of an outer circumference end section wherein a circumference ridge line is formed by having crossed bottom sections of two truncated cones which are sharing a rotating shaft, and a plurality of notches and p...
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WO/2007/005823A2 |
The invention provides apparatus and methods for sawing and singulating individual devices from a silicon or glass-bonded semiconductor wafer. Using methods of the invention, wafer device singulation includes a step of sawing kerfs appro...
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WO/2007/004527A1 |
A dust collection cover (1) capable of efficiently collecting cutting chips and residues generated as a result of cutting a workpiece (3). A cutter (2) includes a motor and a rotary blade (4) driven by the motor, and the dust collection ...
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WO/2007/002745A2 |
Methods and apparatus for making and using tools, for example concrete cutting blades, may use laminations. They may also include inserts, such as structural inserts, damping inserts and fluid flow elements. Fluid flow elements may inclu...
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WO/2006/136235A2 |
A device for artificially aging stones (1), particularly concrete stones, clinker bricks and natural stones comprises a support (2) on which the stones can be placed so that their surfaces (1a) to be treated and the adjoining edges (1b) ...
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WO/2006/136017A1 |
A block impact splitter (10) is comprised of a support frame (11') connected on a swivel (50) to a stationary frame (11). A hammer (15) is provided with a hammer head (16) and secured to a pivotal arm (17) pivotally connected to the supp...
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WO/2006/133798A1 |
Disclosed is a device (10) for positioning and blocking thin silicon wafers (14) after wire-sawing a silicon wafer block (13). Said device (10) comprises a cassette (17) that accommodates the wafer block (13) and is provided with two con...
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WO/2006/134532A2 |
The present invention relates to a tool for stretching the foil (2) of a foil carrier (1), the foil being connected to a frame (3), which tool comprises a circular inner body (6) and a circular outer body (7), the foil being stretched by...
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WO/2006/128433A1 |
The invention relates to a device for lapping or grinding with a cutting wire or with a cutting strip, or similar, comprising an oscillating device for a workpiece (8), by means of which the workpiece is positioned such as to be able to ...
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WO/2006/129798A1 |
A compact cutting device capable of scribing and cutting a plate material such as large-sized and thin plate glasses in a short time without lowering quality. The cutting device comprises a belt conveyor (2) supporting the lower ends of ...
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WO/2006/129563A1 |
A method and a device for cutting off a substrate of fragile material which can prevent the substrate of fragile material from being damaged or contaminated through contact by preventing contact of divided surfaces in a break process for...
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WO/2006/126298A1 |
A cutting device (20) having a bearing (21), a rotating shaft (22) rotatably supported by the bearing (21), a cutting tool (26) composed of a disk-like cutting blade (24) mounted around the rotating shaft (22) and having a through-hole a...
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WO/2006/126302A1 |
A cutting tool (20) capable of cutting or grooving at high accuracy an object independent of the thickness of a disk-like cutting blade used. The cutting tool (20) has the disk-like cutting blade (22) having a through-hole (21) at the ce...
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WO/2006/125559A1 |
The invention relates to a device for separation of damp silicon wafers (2) from a wafer stack (1), whereby the damp wafers (2) may be removed individually from the stack (1), transferred to a subsequent conveyor device (7) and the damp ...
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WO/2006/123950A1 |
A breaking apparatus (1) including a movable mass (3) for impacting on a striker pin (4), a housing (2) and a striker pin (4) configured to partially protrude through the housing (2), the apparatus (1) characterised in that the striker p...
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WO/2006/122532A1 |
The invention relates to a thread milling device which comprises an adjusting ring-feeding mechanism for, for example, milling the edges of masonry and/or metal. Said device comprises a base frame (1) which is similar to two rectangular ...
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WO/2006/123481A1 |
A cutting device whose degree of freedom is increased to expand its range of work. The cutting device has a base (11) pivotally supported at the forward end of an arm, a movement section (12) formed at the upper part of the base (11), a ...
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WO/2006/120736A1 |
The purpose is to provide a silicon block which can be processed into a thin silicon wafer having reduced breakage of a substrate during the manufacture of a solar battery. A method for producing a silicon block by cutting a silicon ingo...
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WO/2006/117935A1 |
A drilling method of a stratum capable of drilling a stratum such as an underground resource endowment layer in liquid by laser irradiation in liquid. A laser beam transmitted by a laser transmission means (20) is applied, as a laser bea...
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WO/2006/117936A1 |
A technology for working, e.g. exfoliating, crashing or boring, a rock or concrete by means of laser while preventing deposition of dross (glassy deposit). That technology is a device (1) for working a rock or concrete with a laser beam ...
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WO/2006/115466A1 |
The invention provides a system for positioning integrated circuits singulated from a substrate, the system including a net block in form of a try, (10a), having a surface for receiving the integrated circuits, said surface at least part...
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WO/2006/101091A1 |
A laser machining method in which chipping can be reduced when a planar workpiece having a modified region is segmented in a step other than its segmentation step. At a portion (50) of a workpiece (1) along a cutting line, a laser beam i...
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WO/2006/101087A1 |
A scribe device for scribing a line on work, where a coarse movement mechanism and a fine movement mechanism are successfully combined to enable a cutter to be accurately stopped at a zero point position. The scribe device has a base (3)...
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WO/2006/101423A1 |
A cutting or sawing machine (1) comprising a machine body (3), at least one disc shaped, rotatable tool (16a, 16b), an elongated tool carrier (14) having the substantial shape of a flat bar having a front end and a rear end, two opposite...
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WO/2006/099717A1 |
A vibratory milling machine has a vibratory housing confined to substantially linear reciprocating motion relative to a base, causing a tool carried by the housing to impact a mineral formation or other work piece substantially in a prim...
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WO/2006/097684A1 |
Apparatus and methods for scoring brittle materials such as glass and ceramics are described. A cutter head that has a wheel assembly comprising a rotatable scoring element with a magnetic field and a magnetic field sensor is used to mon...
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WO/2006/097980A1 |
A user friendly core drill with which cutting of a beveled portion or a counterbore portion can be facilitated at the opening end of a cutting hole when a large-diameter cutting hole is drilled in concrete, or the like, by means of a cor...
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WO/2006/096921A1 |
The specification discloses apparatus (10) mounted on a vehicle (11) for supplying flushing water to concrete cutting apparatus (16) that is mounted on the vehicle (11) but removable therefrom when in use, the apparatus (10) including at...
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WO/2006/096929A1 |
A cutting fluid for use in the cutting of stone such as granite wherein a cutting edge is located adjacent a surface of the stone to be cut and wherein the cutting fluid is applied to an interface between the cutting edge and the surface...
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