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WO/2009/145026A1 |
The issue is to provide a chamfering method that can work even in a narrow space without using an abrasive member and without the need for a washing process to accompany the chamfering process. A brittle material substrate surface is scr...
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WO/2009/143247A2 |
A wire saw for cutting hard materials includes a carbon nanotube fiber wire spun from carbon nanotubes. The carbon nanotube fiber wire may be made from a plurality of fibers, each fiber being spun from carbon nanotubes, the fibers being ...
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WO/2009/142578A1 |
A road grading pick includesa cutting head, a shank, a shoulder at a transition between the cutting head and the shank, and a polygonal-shaped washeror an oval- shaped washer. The shank is positioned in anopening of the washer to positio...
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WO/2009/135681A1 |
The invention relates to a drill comprising a one-piece hard-metal element, which extends transversely over the drill head in a star shape. A cutting edge (22) of the drill head, especially a single one, extends in the central region the...
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WO/2009/133612A1 |
A water-soluble cutting fluid composition which is inhibited from catching fire or generating a gas, is highly safe, and changes little in viscosity; a water-soluble cutting fluid; and a method of cutting with the water-soluble cutting f...
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WO/2009/133832A1 |
Provided are a brittle material breaking apparatus and a brittle material breaking method wherein a brittle material can be broken while continuously moving the brittle material, and the brittle material can be surely broken without alig...
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WO/2009/133453A1 |
The present invention relates to a process for reinforcing blocks (1) or slabs of stone material in a quarry, including the cutting and/or perforation of a bench (2) at at least three faces of a block to be obtained and its separation fr...
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WO/2009/134968A1 |
Embodiments of the present invention are directed to a fixture assembly that is capable of holding work pieces such tiles of various sizes in various positions in a manner which enables freehand cutting. Various embodiments include a mai...
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WO/2009/134212A1 |
A system for cutting a plurality of substrates of integrated circuit units comprising a plurality of tables (40, 55), each table including a plurality of trays (37A, 37B, 57A, 57B), each tray arranged to receive one of said substrates; e...
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WO/2009/130549A1 |
The device (1) for wire sawing of a piece (10) to be sawed that is mounted on a support table (20) comprises fastening means (15, 26, 40) for fastening said piece (10) to be sawed to a carriage (18) apt to cooperate with a guide rail of ...
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WO/2009/128334A1 |
A method of machining a fragile material substrate enables stable laser break processing. The method of machining, in machining the substrate from a first substrate end to a second substrate end along a scribe-scheduled line, executes a ...
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WO/2009/128314A1 |
Provided is a method for processing a fragile material substrate that can carry out stable laser break processing. A method for processing a fragile material substrate comprises (a) an initial crack forming step of forming an initial cra...
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WO/2009/128315A1 |
Provided is a method for processing a fragile material substrate that enable to stably execute laser break processes, such as complete cutting-off of the substrate and forming of a deeper scribe line. A method for processing a fragile ma...
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WO/2009/128316A1 |
Provided is a method for processing a fragile material substrate that enables to stably execute processes, such as complete cutting off of the substrate and forming of a deeper scribe line. A method for processing a fragile material subs...
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WO/2009/124415A1 |
A stone saw blade is a longitudinal rectangular long-bar in shape and has two opposite longitudinal upper top surface (20) and lower bottom surface (20'), two opposite longitudinal lateral surfaces (10, 10'), and two opposite end surface...
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WO/2009/073804A9 |
Self-propelled cutting apparatus and related methods are disclosed. An exemplary apparatus includes a frame to which are mounted at least one cutting device and a locomotion device. A control device, coupled to the locomotion device and ...
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WO/2009/112838A1 |
A method of producing a strip of laminate stone material, the method including the steps of slicing a plurality of thin sheets of stone, bonding the sheets to form a laminate structure, and cutting the laminate structure end-on to produc...
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WO/2009/112960A1 |
Method for sawing blocks of stone material by means of a multi-blade machine, comprising a blade-holder frame (20) provided with straight cutting blades, in which said frame is brought into contact with the block (50) to be cut with a re...
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WO/2009/109405A1 |
The invention relates to a grinding tool for building elements or building constructions made of concrete, stone, brick and similar mineral substances for producing a T-shaped back-cut notch in the building element (50) or building const...
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WO/2009/109837A1 |
An apparatus (1) for dividing flat products (M), comprising conveying means (3, 4) for introducing into said apparatus (1) and extracting from said apparatus (1) a flat product (M), incision means (9) for making incisions on a visible su...
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WO/2009/108094A1 |
A saw (1) being portable and/or wheeled, such as a wall saw, floor saw or masonry saw,comprising a rotatable circular saw blade (3), a drive motor (5) with an output shaft (9) for rotating the saw blade (3), and a transmission (20) for i...
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WO/2009/107153A1 |
A machine (1) for multiple wire cutting of stone materials comprises a supporting structure (2), a plurality of cutting devices (7) mounted parallel with each other on the supporting structure (2) and a supporting device (12) for the cut...
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WO/2009/108093A1 |
The present invention relates to an electric saw (1) being powered by an external power supply (200) through a multicore cable (6). The multicore cable (6) includes electrical wires (24, 25, 27) for supplying power to the motors (5, 12, ...
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WO/2009/107794A1 |
A separation device of a mother board for a plane display panel consists of a plurality of tables for sucking and fixing one plane display panel, and a moving device for moving a part of the plurality of tables relatively to other tables...
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WO/2009/104412A1 |
A processing machine (1) of plate glass is arranged such that angular control of a cutting head (9) and a grinding head (10) provided, respectively, with angle control motors (46, 49) is performed synchronously about axes (39, 39) inters...
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WO/2009/104222A1 |
Provided is a wire saw comprising a wire wound on a plurality of grooved rollers, for reciprocating in the axial direction, a nozzle for feeding a slurry, a patch, and a work feeding device for feeding a work being held, to the wire thro...
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WO/2009/101339A2 |
Abrasive grain powder, especially for machining silicon ingots, such that the D40‑D60 particle size fraction comprises more than 15% and less than 80%, by volume per cent, of grains having a circularity of less than 0.85.
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WO/2009/101761A1 |
Cylindrical grinding equipment for grinding the side face of a columnar ingot, comprising at least three rollers, and a centering means consisting of an arm for supporting the rollers and coming into pressure contact with the rollers by ...
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WO/2009/101760A1 |
A blade fixing jig set comprising, at least, two guide pins each fixed coaxially with a shaft of a pulley to the lower end of the shaft of the pulley, a jib body having plural supporting members for supporting the side surface of a blade...
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WO/2009/102630A1 |
A wiresaw beam for use in an apparatus for slicing wafers from an ingot, such as semiconductor wafers from a single crystal ingot or a polycrystalline silicon ingot. The wiresaw beam may be made from a polymer composite material comprisi...
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WO/2009/098699A1 |
A guide bar (100, 200) for power chain saws, such as concrete cutting chain saws, whereas the guide bar (100, 200) includes a toothless front pulley (140, 240), which includes a four-point bearing and dirt trapping grooves (149). The gui...
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WO/2009/097987A1 |
The present invention relates to a method for laser cutting a nonmetal workpiece (1) along at least one cut line (SL) for generating at least two workpiece parts (1a, 1b), wherein the workpiece (1) has laser light (2) applied thereto, lo...
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WO/2009/099130A1 |
Polycrystalline diamond usable in many applications is provided. Also provided are a water-jetting orifice, stylus tool for gravure printing, scriber tool, diamond tool for cutting, and scribing wheel each employing the polycrystalline d...
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WO/2009/097849A1 |
A fine-grained material pounding device (PD) for pounding/cutting fine-grained materials (FGM), such as slate, fiber cement or tile, is disclosed, comprising a housing, at least one movable cutter, one or more jaw elements for resting on...
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WO/2009/098721A1 |
A machine (1) for wire cutting stone material comprises a supporting element (11), at least one connecting element (12) connected to the supporting element (11), at least one motor-driven pulley (7) and a tensioning device (13). Mounted ...
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WO/2009/093660A1 |
A cutter head device for a glass cutting machine has a cutter wheel for making a cut line in a glass plate, a cutter holder for rotatably supporting the cutter wheel, a head body for supporting the cutter holder via a plate spring so tha...
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WO/2009/087723A1 |
Disclosed is an ingot cutting apparatus characterized by comprising at least an ingot supporting pad for supporting the cut ending portion of an ingot from below at the position of a clearance of a cutting table for cutting the ingot wit...
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WO/2009/084068A1 |
A process for the complete separation of the suspending fluid from the solid components container in an exhausted slurry, either abrasive or not, coming from the cutting operation or other mechanical working of materials of monocrystalli...
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WO/2009/084489A1 |
Provided is a laser working apparatus which can apply an auxiliary parting force to the parting plane of the crack in accordance with the progressing situations of a crack, thereby to perform a full-cut work reliably to the terminal end ...
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WO/2009/084276A1 |
Provided is a laser processing apparatus which can easily and surely perform steps from double face scribing to double face breaking. The laser processing apparatus is provided with a first beam scanning optical system (22a), which shape...
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WO/2009/084398A1 |
Provided is a method for forming cracks on a substrate made of a brittle material by surely stopping a second crack at an intersection with a first crack. The first crack is formed by first laser scribing, then, after adhering a friction...
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WO/2009/081621A1 |
Provided is a laser processing apparatus wherein a cutting state of a substrate is correctly controlled in each processing step so that the substrate is surely not cut in a step of scribing by laser irradiation and the substrate is surel...
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WO/2009/081245A1 |
A method for separating and recovering silicon debris from sawing waste is characterized in that it comprises the following steps: - treating the sawing waste so as to deoxidize the silicon debris in a manner that reduces their surface e...
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WO/2009/081524A1 |
Disclosed are a band-saw cutting apparatus, in which an endless-belt blade constituted of a blade abrasive-grain portion and a blade base is tensed between pulleys and in which a pair of static pressure pads having coolant injection port...
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WO/2009/078130A1 |
A wire saw for cutting a work into a wafer shape by winding a wire around a plurality of grooved rollers and applying the work to the wire while supplying slurry to the grooved rollers and running the wire, characterized in that the wire...
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WO/2009/078400A1 |
A cutting device having a ring saw can easily perform high-speed cutting of rock, stone, concrete, or the like. To cut such a material, the cutting device rotates the ring saw while applying impact force to the material and cuts the mate...
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WO/2009/078884A1 |
A gemstone is provided that has an improved brilliance, especially at the crown portion of the gemstone. The gemstone has a crown angle that is less than an ideal cut round diamond and, preferably the crown angle is less than 27 degrees....
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WO/2009/077282A1 |
The invention relates to a wire spool, particularly for receiving saw wire during wire sawing, comprising a spool body having at least one attachment flange (2, 3) on a spool body front side. According to the invention, the spool body ha...
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WO/2009/078324A1 |
Provided is a method for chamfering/machining brittle material substrates, by which the substrate surfaces can be chamfered or rounded. A laser beam is applied to an edge line (EL) where chamfering/machining is to be performed such that ...
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WO/2009/074776A1 |
Cutting apparatus (10) includes a pilot arrangement (20) which has a tip (42). The tip engages a workpiece to form a pilot recess to engage the workpiece and prevent the apparatus skidding across the surface of the workpiece. The tip (42...
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