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WO/2020/246132A1 |
The present invention provides a urethane resin composition which contains a urethane resin (A), water (B) and an auxiliary film-forming agent (C), and which is characterized in that the auxiliary film-forming agent (C) is polyethylene g...
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WO/2020/241565A1 |
This composition contains a hydrophilic resin, a basic polymer containing a nitrogen atom, an amino acid and an alkali metal compound. The alkali metal element contained in the alkali metal compound comprises at least one of rubidium and...
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WO/2020/238260A1 |
The present invention relates to the technical field of graphene composite materials, and in particular, to a vertical graphene-high molecular polymer composite material, comprising a substrate, vertical graphene, and a high molecular po...
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WO/2020/242232A1 |
The present invention relates to a thermoplastic resin composition and a molded product using same, the thermoplastic resin composition comprising (C) 2 to 20 parts by weight of block copolymer comprising polyether segments and polyamide...
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WO/2020/241164A1 |
This releasing agent for plastics is characterized by containing components (A)-(E) and having an average particle diameter of 200 nm or less. Accordingly, a releasing agent for plastics, that has excellent dilution stability and mechani...
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WO/2020/235006A1 |
An elastomer composition for a damping member that has an A hardness of 50 or less and includes a hydrogenated thermoplastic styrene elastomer A, which is a hydrogenation product of a block copolymer composed of a styrene polymer block (...
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WO/2020/232691A1 |
The present invention relates to the technical field of electronic packaging materials, and specifically relates to a flexible material used for capacitors, a preparation method therefor and a printed circuit board. The flexible material...
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WO/2020/236894A1 |
Disclosed herein are amphiphilic polymers and hierarchical structures (e.g., emulsions) comprising said polymer. Also disclosed herein are methods of using the polymers and hierarchical structure disclosed herein.
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WO/2020/234096A1 |
The present disclosure relates to an additive manufacturing (AM) method for making a three-dimensional (3D) object, using a part material (M) comprising at least one poly(ether ketone ketone) (PEKK) polymer, in particular to a 3D object ...
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WO/2020/235498A1 |
The present invention pertains to: a resin composition including (a) a polyphenylene ether resin, (b) a polypropylene resin, (c) an admixture, (d) an inorganic filler, and (e) a hydrotalcite-like compound; and a molded article obtained b...
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WO/2020/228363A1 |
Disclosed are a two-component liquid silica gel for 3D printing and a printing method therefor. The liquid silica gel for 3D printing contains two components, A and B, wherein component A comprises 100 parts of vinyl polysiloxane, 0.01-5...
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WO/2020/232462A1 |
This disclosure is directed to methods for preparing thermoplastic surfaces suitable for the application of paint, adhesives, or surfacing films and the structures derived or derivable from these methods. The disclosure is also directed ...
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WO/2020/230870A1 |
One aspect of the present invention pertains to a copper-clad laminated plate provided with: an insulation layer containing a cured product of a resin composition; and a surface-treated copper foil disposed on one surface or both surface...
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WO/2020/230697A1 |
[Problem] The present invention relates to a polymeric composite material that contains a low-molecular lipid-peptide gelling agent and a polyalkylene oxide, and provides a polymeric composite material that has both strength and malleabi...
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WO/2020/229331A1 |
The present invention relates to moisture curable compositions based on silane-terminated polymers in paste form that can be used as 3D printing materials and provide isotropic and elastomeric properties. The invention further relates to...
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WO/2020/222973A1 |
An ultraviolet light-curable coating composition includes 5-40 weight percent of an ultraviolet light-curable poly(polyphenylene ether) oligomer; 60-95 weight percent of an ultraviolet light-curable monomer, oligomer, polymer, or a combi...
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WO/2020/217676A1 |
Provided are a curable resin composition, the cured product of which is endowed with excellent heat resistance and dielectric properties, a cured product of the curable resin composition, and a prepreg, a circuit board, a build-up film s...
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WO/2020/217225A1 |
A laser platable thermoplastic composition includes from about 38 wt% to about 90 wt% of a thermoplastic polymer, from about 0.01 wt% to about 15 wt% of a laser activatable metal compound, and from about 0.01 wt% to about 60 wt% of a mag...
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WO/2020/218263A1 |
The present invention addresses the problem of providing: a rubber composition which is superior in breaking strength and tensile elongation to rubber compositions produced without incorporating cellulose nanofibers; and a dipping latex ...
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WO/2020/213527A1 |
Provided are: a resin film that can achieve improved thermal dimensional stability without a reduction in the low-dielectric properties and heat resistance characteristic of a film that is for use, for example, in a high-frequency circui...
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WO/2020/213406A1 |
The purpose of the present invention is to provide a thermoplastic resin prepreg from which a fiber-reinforced composite material having excellent mechanical strength is obtained even when formed at a low temperature in a short period of...
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WO/2020/207320A1 |
Disclosed are a medical material and a preparation method thereof, the preparation method comprising the following steps: S1: subjecting a thermoplastic elastomer to extrusion and granulation to obtain thermoplastic elastomer particles; ...
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WO/2020/203666A1 |
This fluoropolyether group-containing compound is represented by formula (1) or (2) below [in the formula, RSi is represented by formula (S1), and each symbol is as described in the description]. Formula (S1): -X1-SiRa1 p1Rb1 q1Rc1 r1
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WO/2020/203320A1 |
An aspect of the present invention relates to a resin composition which comprises a modified poly(phenylene ether) compound having a carbon-carbon unsaturated double bond at a molecular end, a maleimide compound having two or more N-subs...
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WO/2020/203230A1 |
Provided are: a vinylidene-fluoride-based polymer composition which is less apt to lather at time of use and hence has satisfactory handleability and which contains no fluorinated surfactant; and a method for producing a vinylidene-fluor...
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WO/2020/204175A1 |
This invention pertains to a resin composition containing: a phosphate ester flame retardant (A) having an aromatic hydrocarbon group containing two or more aromatic ring structures; and a polyphenylene ether derivative (B) having an eth...
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WO/2020/196664A1 |
This resin composition contains insulating filler with a 6.0 or higher specific gravity, and a resin that has a polar group, wherein the content ratio of the insulating filler with a 6.0 or higher specific gravity is greater than or equa...
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WO/2020/196617A1 |
This resin composition contains a first resin and a second resin, and exhibits curability by thermal crosslinking, wherein the first resin is at least one selected from among a bifunctional epoxy resin having a weight average molecular w...
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WO/2020/194130A1 |
A flame-retardant composition is described comprising a mixture of a water dispersible organic polymer; and a water dispersible derivative of an unsaturated dicarboxylic acid or anhydride thereof. The water dispersible derivative typical...
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WO/2020/196224A1 |
The present invention pertains to a release sheet having a release layer and a base material, the release sheet being such that the release layer is a cured article of a release agent composition that includes a phenoxy resin (A), an ami...
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WO/2020/196606A1 |
A polystyrene resin composition is provided which has a resin (A) that includes a polystyrene resin (A1) having a syndiotactic structure and a polyamide (A2), a compatibilizer (B), a rubber-like elastic body (C) and an inorganic filler (...
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WO/2020/196243A1 |
The present invention provides a resin composition with which it is possible to produce a molded article that has exceptional tensile elongation at break without causing surface peeling and also has an exceptional low dielectric constant...
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WO/2020/196776A1 |
The present invention addresses the problem of providing a protection member which is for a semiconductor and has excellent pattern retention at high temperatures and moisture resistance and has good adhesion to a semiconductor circuit, ...
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WO/2020/196477A1 |
Provided is a thermally conductive resin sheet having sufficient withstand voltage performance and excellent moisture absorption reflow tolerance that comprises a resin composition containing a crystalline thermoplastic resin having a fu...
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WO/2020/196228A1 |
A curable composition that comprises polyoxyalkylene-based polymer (A) having reactive silyl groups and (meth)acrylate-based polymer (B) having reactive silyl groups. In polymer (A), the average ratio of the number of the reactive silyl ...
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WO/2020/196222A1 |
This release sheet having a substrate and a release layer, the release layer including a cured product of a release agent composition including a phenoxy resin (A), an amino resin (B), and a silicone compound (C) having a crosslinkable f...
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WO/2020/196240A1 |
The present invention pertains to: a sheet-like adhesive agent containing components (A), (B), and (C); a sealing sheet that contains said sheet-like adhesive agent; and a sealed body obtained by sealing, using said sealing sheet, an obj...
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WO/2020/197261A1 |
A polyamide resin composition of the present invention comprises: approximately 100 parts by weight of a polyamide resin comprising approximately 5 to 40 weight% of an aromatic polyamide resin and approximately 60 to 95 weight% of an ali...
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WO/2020/196759A1 |
One aspect of the present invention resides in a prepreg including a resin composition or a semi-cured product thereof and a fibrous base material, wherein the resin composition includes a polymer having a structural unit represented by ...
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WO/2020/196070A1 |
This resin sheet is formed from a resin composition containing a thermosetting component (A), and is characterized in that: the thermosetting component (A) contains a first maleimide resin (A1); the first maleimide resin (A1) has at leas...
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WO/2020/195873A1 |
Provided is a silicone composition that contains (A) an organopolysiloxane having a specific group bound to a silicon atom and having a viscosity of 20-20,000 mPa·s at 25°C and (B) a specific alkylether carboxylic acid or a salt thereo...
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WO/2020/196574A1 |
The present invention provides a polymer-containing composition which has further improved re-contamination prevention ability in comparison to conventional polymers. The present invention is a polymer-containing composition which is cha...
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WO/2020/196864A1 |
Provided are a foam and sound-absorbing material that have excellent sound-absorbing characteristics, and a building and vehicle that comprise said sound-absorbing material. Further provided are a resin composition that is capable of sup...
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WO/2020/196718A1 |
The present invention provides a material that has a low dielectric loss tangent and is suitable for use as an insulating material for a printed wiring board or the like, a resin composition used to produce the material, and applications...
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WO/2020/195656A1 |
Provided is a method capable of easily producing a formed body having a region in which a filler is aggregated in a resin. The formed body of the present disclosure contains a resin and a filler, and formed by an aggregation part that ...
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WO/2020/189401A1 |
Provided are an adhesive film, a flat cable, and an insulating film excelling in toughness and adhesive strength, and capable of achieving a lower dielectric constant and a lower dielectric loss tangent. More specifically, an insulating ...
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WO/2020/188521A1 |
A rubber compound for body ply skim comprising: - a mix of rubber consisting of (i) Epoxidized Natural Rubber acting as polymer base with a cross-linkable unsaturated chain; (ii) Natural Rubber acting as polymer base with a cross-linkabl...
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WO/2020/190488A1 |
A composite includes at least one thermoplastic polymer; and at least one PTFE-based polymer, such that the composite has a dielectric loss tangent of less than 10-3. Moreover, a method for preparing a composite includes mixing at least ...
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WO/2020/189645A1 |
A method for producing a cell culture carrier configured from a hydrogel having high shape retentivity and a device for producing the cell culture carrier are developed, and a structure comprising a cell culture carrier produced using th...
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WO/2020/183834A1 |
This resin composition contains, with respect to 100 parts by mass of an aromatic polycarbonate resin (A): 0.1-3 parts by mass of a polyoxytetramethylene glycol-based multidimensional polymer (B); and 0.005-0.4 parts by mass of a phospho...
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