| Document |
Document Title |
|
WO/2022/014451A1 |
Provided are a mounting device and a mounting method that enable highly precise mounting at a sub-micron level. Specifically, the present invention provides a mounting device comprising: a substrate stage for holding a substrate; a mount...
|
|
WO/2022/013159A1 |
A method of inspecting a printed circuit board, PCB, assembly (C) comprising the steps of: acquiring an image (IM) of the PCB assembly (C)and analyzing the image (IM), wherein the analysis comprises an object-based analysis of the image ...
|
|
WO/2022/013941A1 |
Provided is a simulation device comprising: a database storing shape data of an apparatus with which a component mounting machine for implementing a component mounting process to mount a component onto a substrate is equipped in a replac...
|
|
WO/2022/009646A1 |
The present invention provides a storage case that, regardless of the number of electronic components stored therein, prevents a component takeout port from being easily clogged with the electronic components and prevents the electronic ...
|
|
WO/2022/009412A1 |
This part shipping system comprises: a storage device which stores part information including, for each part, a part ID that identifies a part and the presence or absence of security; an input device through which information is input; a...
|
|
WO/2022/009382A1 |
This tape feeder pulls a component supply tape, which is formed by adhering a cover tape to a carrier tape accommodating a plurality of components, out from a reel, delivers the component supply tape to prescribed supply positions, and p...
|
|
WO/2022/009409A1 |
This component mounting device 10 is a device for mounting a component on a substrate S using a mounting head 18. The component mounting device 10 comprises: a nozzle holder provided in the mounting head 18 and extending in a vertical di...
|
|
WO/2022/009381A1 |
This tape feeder delivers a component supply tape, which is formed by adhering a cover tape to a carrier tape accommodating a plurality of components, to prescribed supply positions, and peels the cover tape from the carrier tape before ...
|
|
WO/2022/009336A1 |
Provided is a component supply method for supplying components scattered on a stage, the component supply method comprising: a storing step of storing, on the basis of imaging data of components scattered on a stage, position information...
|
|
WO/2022/009298A1 |
Provided is an electronic component mounting machine capable of detecting that an electronic component of an erroneous component type may be supplied.　The electronic component mounting machine is capable of having mounted thereon a tap...
|
|
WO/2022/003772A1 |
A component mounting system is provided with: a mounting machine for performing a mounting process of mounting a component on a substrate by operating a mounting process unit; an inspection machine for performing an inspection process us...
|
|
WO/2022/003919A1 |
This inspection data preparation method comprises: a step for acquiring a mounted substrate image (40); a step for extracting a component image (41) of a component (C) in the mounted substrate image; a step for acquiring a degree of comp...
|
|
WO/2021/258730A1 |
Provided are an inserting apparatus and an inserting machine. The inserting apparatus comprises: a mounting plate (8); a clamping head (2) used for clamping an electronic component; a lifting mechanism mounted on the mounting plate (8) a...
|
|
WO/2021/251692A1 |
The present invention relates to a component supply apparatus which supplies a component seated on a carrier to a chip mounter, the component supply apparatus comprising a component separation prevention module of a single structure whic...
|
|
WO/2021/246091A1 |
The present invention determines whether or not identification information (first identification information) in a component position detection method used when a mounting component position is detected by an inspection device coincides ...
|
|
WO/2021/245885A1 |
A component mounting system (100) comprises a mounting machine (1) and a management device (6) which are data-communicatively connected to each other. The mounting machine (1) comprises: a mounting head (251) for performing a component m...
|
|
WO/2021/247174A1 |
A dispensing system includes a frame, a support, a dispensing unit assembly, and a gantry. The gantry is configured to support the dispensing unit assembly and to move the dispensing unit assembly in x-axis and y-axis directions. The dis...
|
|
WO/2021/245732A1 |
Provided is a working machine for a substrate, the working machine comprising: a pair of conveyance lanes for conveying the substrate; and a bending device for bending a lead of a lead component, wherein the bending device is arranged be...
|
|
WO/2021/246092A1 |
Provided is a component mounting line comprising a component mounting device for mounting a component onto a substrate, and an inspection device for receiving a substrate unloaded from the component mounting device and inspecting the com...
|
|
WO/2021/243545A1 |
An electronic part mounting device, comprising a first fixing frame (1) and a second fixing frame (2). Screw placement grooves (3) are respectively provided in the rear walls of the top surfaces of one side of the first fixing frame (1) ...
|
|
WO/2021/241389A1 |
A component mounting device according to the present invention comprises: a component supply part on which is detachably mounted a component supply unit that supplies components accommodated in carrier tape; a feeder information acquisit...
|
|
WO/2021/240979A1 |
The disclosed manufacturing method comprises: a step for forming a solder precoat (2) on a land (1b); a step for holding a substrate (1) by means of a first substrate holding part, and acquiring height position information PH1 regarding ...
|
|
WO/2021/240646A1 |
A component holding tool provided with a pair of claw members that comprise holding surfaces facing each other, and that are for holding a pair of leads of a lead component by approaching each other, wherein the movement amount of one cl...
|
|
WO/2021/241095A1 |
A device for manufacturing a semiconductor device comprises: a stage (12); a bonding head (14); a following mechanism (22) mounted on the bonding head (14); and a controller (34) that executes an adjustment process. In the adjustment pro...
|
|
WO/2021/240638A1 |
This substrate manufacturing system (100) comprises: an autonomous travel cart (31) that conveys an article used in a substrate work device (15) of an installation line (10); and a robot arm (40) that is provided to the autonomous travel...
|
|
WO/2021/240961A1 |
This parts feeder (parts feeding unit) for feeding parts to a parts mounting device for mounting parts on a substrate is provided with: a first control section (feeder control section) that controls motion of the parts feeder; a first co...
|
|
WO/2021/240697A1 |
This brake control apparatus is provided with an electric motor, a power supply device, a plurality of electric circuits, a brake device, and a restriction device. The electric motor moves an article conveyance device that conveys an art...
|
|
WO/2021/240626A1 |
This substrate manufacturing system is provided with: an autonomous traveling bogie (31) that conveys an object to be used in a substrate work device (15) of a mounting line (10); a robot arm (40) that is provided to the autonomous trave...
|
|
WO/2021/239765A1 |
A method for mounting a component (100) on a workpiece (106), the method comprising obtaining information regarding a surface topography of at least one of a mounting surface (102) of the component and a local surface (108) of the workpi...
|
|
WO/2021/237823A1 |
A mini light emitting diode backlight module and a manufacturing method therefor. The method comprises: (101) providing a carbon paste solution; (102) coating the carbon paste solution on a substrate (201) to form a carbon paste array (2...
|
|
WO/2021/233739A1 |
The invention relates to a printed circuit board connection terminal package (100) for receiving printed circuit board connection terminals (200) having solder pins (211), said printed circuit board connection terminal package comprising...
|
|
WO/2021/235933A1 |
The present disclosure provides a physical object processing system (1) that comprises a process station (10), a transport facility (20), an optical imaging system (30), an image sensor (40) and data process facilities (50). The transpor...
|
|
WO/2021/235201A1 |
The problem addressed by the present disclosure is that of pre-empting and preventing the defective mounting of a second target object on a first target object. The quality change detection method according to the present disclosure incl...
|
|
WO/2021/234848A1 |
A component mounting system (100) is configured such that a pick-and-place machine (1) and an inspection device (5) are data-communicably connected with a management device (6). The pick-and-place machine (1) includes a mounting analysis...
|
|
WO/2021/229674A1 |
Pallet retrieval is performed to transport a pallet P in which the number of remaining components has become zero from a fixed magazine 55 to a resupply magazine 54, and pallet preparation for mounting, onto the fixed magazine 55, a pall...
|
|
WO/2021/224974A1 |
A component mounting machine for mounting electronic components to a substrate, wherein said component mounting machine comprises: a peripheral unit that has a storage unit and that handles an electronic component or a substrate; and a c...
|
|
WO/2021/221308A1 |
The present invention relates to a mini light-emitting diode (LED) removal device which removes defective mini light-emitting diodes from a mini light-emitting diode display module in which a plurality of mini light-emitting diodes are m...
|
|
WO/2021/220850A1 |
A production control device (100) is provided with an acquiring portion (108) for acquiring production data indicating a production plan for producing a plurality of mounting boards by means of a production system (1), and progress data ...
|
|
WO/2021/220385A1 |
This component mounting machine that mounts electronic components on a board, comprising: a nozzle that holds an electronic component; a circuit that is formed on the nozzle and is provided with a sensor that detects the mounting state o...
|
|
WO/2021/214973A1 |
A circuit forming method for forming a circuit using a curable resin and an electrically conductive fluid, the method comprising: a setting step for setting errors that occur during a circuit formation operation according to the type of ...
|
|
WO/2021/214331A1 |
An apparatus (10) for assembling a heater assembly for a nicotine pod assembly includes a base (14), a wick feed (234), a slide (22), and a holder (30). The wick feed (234) extends toward the base (14) and defines a channel (242) configu...
|
|
WO/2021/216720A1 |
A magnetic separating conveyor output roll including a first plurality of magnetic rings, each of such magnetic rings having radially inner and radially outer ends, each such magnetic ring having annular north and south poles respectivel...
|
|
WO/2021/216266A1 |
An apparatus for assembling a heater assembly for a non-nicotine pod assembly includes a base, a wick feed, a slide, and a holder. The wick feed extends toward the base and defines a channel configured to receive a wick structured to dra...
|
|
WO/2021/214908A1 |
Provided is a control device for a mobile work device that is used in a mounting system equipped with a mounting-related device that executes a mounting-related process related to component mounting and moves in a predetermined direction...
|
|
WO/2021/211239A1 |
A dispensing system includes a dispensing unit assembly configured to dispense viscous material and a gantry coupled to the frame. The gantry is configured to support the dispensing unit assembly and to move the dispensing unit assembly ...
|
|
WO/2021/210187A1 |
A component mounter comprises: a mounting head for supporting a holding member that can hold a component; a mounting control unit that controls a mounting operation by performed by the mounting head so that the component is mounted in a ...
|
|
WO/2021/205980A1 |
The present disclosure addresses the problem of improving the productivity of a second object whereon a first object is mounted. A mounting system (1) according to the present disclosure comprises: a mounting head (11); a first imaging d...
|
|
WO/2021/205514A1 |
A tape feeder comprising: a path for feeding out a taped lead component, which is a lead component that has been taped, to a supply position; a sensor which is placed on the path and detects the taped lead component; and a notification d...
|
|
WO/2021/205612A1 |
This production system comprises: a first production line and a second production line which are mutually aligned side by side; and a first feeder exchange device and a second feeder exchange device which are respectively provided to the...
|
|
WO/2021/205578A1 |
This image processing device processes an image of a tape which has a plurality of cavities for storing components to be supplied, the device comprising: a feature amount acquisition unit that uses the image to extract the luminance of p...
|
