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WO/2012/060368 |
The purpose is to supply parts using a simple and uniform stick structure, so that the parts are without positional deviation and are stably erected regardless of changes in sizes and shapes of the parts. This part receptacle stick for p...
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WO/2012/056617 |
The objective of the present invention is to provide an electronic-parts mounting apparatus and a method of executing electronic-parts mounting work, wherein quality of work and productivity can be made to be compatible. Height-precision...
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WO/2012/056606 |
The objective of this invention is to provide an electronic component mounting device and an electronic component mounting method capable of ensuring a stable pickup operation even when dimensional error exists in the electronic componen...
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WO/2012/053852 |
The present invention relates to a vision inspection apparatus which captures, with a camera, an inspection object assembled or mounted during a component assembly process, and compares the captured image and a previously inputted image ...
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WO/2012/050096 |
[Objective] To provide a parallelism adjustment method and a parallelism adjustment apparatus for a mounting apparatus, wherein parallelism between a substrate stage and a bonding tool can be adjusted with high-precision, and in a short ...
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WO/2012/049797 |
The objective of the present invention is to provide a tape feeder and a method of mounting a tape onto the tape feeder, wherein positioning upon mounting a carrier tape can be made easier, and workability and working efficiency can be i...
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WO/2012/049799 |
The objective of the present invention is to provide a tape feeder and a method of mounting a tape onto the tape feeder, wherein positioning upon mounting a carrier tape can be made easier, and workability and working efficiency can be i...
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WO/2012/049352 |
A chip (201) is attached to a printed conductive surface. The chip is first heated to a first temperature, which is lower than what the chip can stand without being damaged by the heat. The heated chip is pressed against the printed cond...
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WO/2012/049798 |
The objective of the present invention is to provide a tape feeder and a method of mounting a tape onto the tape feeder, wherein positioning upon mounting a carrier tape can be made easier, and workability and working efficiency can be i...
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WO/2012/046494 |
The present invention addresses the problem of providing an electronic component mounting apparatus having high efficiency in an electronic component transfer operation. An electronic component mounting apparatus (1) is provided with: a ...
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WO/2012/039170 |
An objective is to improve practicality in forming conductive circuits on circuit substrates in a circuit substrate working machine and a circuit substrate working system. Head retaining units are disposed on a second x-axis slide of a h...
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WO/2012/039172 |
Provided are a more practical tape feeder, component supply device, and component supply method. Two tape-shaped components (120) are respectively conveyed by conveyor devices in a state wherein one of the tape-shaped components (120) is...
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WO/2012/035704 |
The purpose of the present invention is to provide an electronic component mounting device and an electronic component mounting method for mounting, on one substrate, electronic components having the same electrical characteristics even ...
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WO/2012/035416 |
A pick-and-place tool configured to pick and place at least one die on a workpiece includes a mounting head. The mounting head includes a die position determining unit configured to one of measure and detect an actual position of at leas...
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WO/2012/036458 |
The present invention relates to a printed circuit board and a method for mounting an electric part, in which the electric part is inserted into an insertion hole of a board body to minimize the thickness of the printed circuit board. Ac...
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WO/2012/035703 |
The objective of the present invention is to provide: an electronic component mounting device that is caused to be such that various types of electronic component having equivalent electrical properties are mounted to a single substrate;...
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WO/2012/034945 |
The present invention generally relates to a transport unit for transporting a print support, or substrate, through a plant that deposits print tracks on a surface of the print support. The plant has at least one print station having at ...
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WO/2012/032701 |
A substrate receiving device (3) loads and retains a rigid substrate (6), and receives pressure during a thermocompression bonding operation of a flexible substrate (8). The substrate receiving device (3) comprises a sheet-shaped receivi...
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WO/2012/033589 |
In one aspect, a device includes a first portion having a length substantially the same as a length of a gap of a slot of a free link of a reel feeder. The device is configured to be placed in the gap to limit movement of a take-up arm a...
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WO/2012/031362 |
The present invention relates to technologies for integrated circuits and Large Area Integrated Circuits (LAICs), which are integrated circuits made from photo-repetition of one or several reticle image fields, stitched together on at le...
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WO/2012/030837 |
An imaging system including a back-plane reflector having a concave aspherical reflecting surface and an outer diameter that is no greater than a first distance, with an aperture formed in the back-plane reflector, the aperture for admit...
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WO/2012/026101 |
A mounting head (2) includes suction nozzles (11A to 11C), image capturing cameras (23A to 23C), and a movable mirror unit (27). When the mirror unit (27) is in the advance position, mirrors (38A, 38B) advance into the field of view of t...
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WO/2012/026073 |
The invention provides a component mounting device adapted to handle diverse recognition objects and configured to take up minimal space so as to meet the need for compact size; and also provides an illumination device and illumination m...
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WO/2012/026072 |
A component mounting device, and an illumination device and illumination method for imaging in the component mounting device, are provided that can respond to diverse recognition objects, and can reduce the space required in response to ...
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WO/2012/023250 |
Disclosed are a component-mounting device and component-detection method that make it possible to detect, with high precision, the presence or absence of a component on a suction nozzle of a mounting head even when working with an elonga...
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WO/2012/023351 |
An objective of the present invention is to improve the utility of a circuit substrate processing device comprising a shuttle conveyor that shifts a circuit substrate in a direction that intersects the conveyance direction thereof, and a...
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WO/2012/023251 |
Disclosed are a component-mounting device and component-detection method that make it possible to detect, with high precision, the presence or absence of a component on a suction nozzle (11) of a mounting head (10) even when working with...
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WO/2012/017594 |
The purpose of the present invention is to provide a component mounting method that enables setup work to be performed ahead of time when switching component types, thereby reducing equipment downtime associated with the switching of com...
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WO/2012/017593 |
The purpose of the present invention is to provide a method of mounting parts, wherein job setup work necessary upon switching the product type can be executed in advance, and the stopping time of an apparatus necessary for switching the...
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WO/2012/016258 |
In the case of an adhesive for fixing an electronic component (3) on a circuit board (1) and/or for embedding an electronic component (3) into a circuit board (1), the electronic component (3) to be fixed and/or embedded being fixed by m...
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WO/2012/014467 |
Provided is a parts mounting apparatus, wherein vacuum attainment time and vacuum breakage time can be shortened, and stability in sucking-up and mounting parts is improved. The parts mounting apparatus (10), wherein a part supplied from...
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WO/2012/014534 |
Provided is an industrial machine equipped with a camera (21) for picking up an image of an object the image of which needs to be picked up, wherein the camera (21) has a CPU (23), RAM (25), and flash memory (26) installed therein, and t...
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WO/2012/011926 |
A method and apparatus for sensing a conductive object by a mutual capacitance sensing array is described according to an embodiment of the present invention. The mutual capacitance sensing array comprises one or more sensor elements. Ea...
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WO/2012/004919 |
During component mounting including component supply by means of a tray feeder, disclosed are a component-mounting device and a component-mounting method that are able to secure safety when performing a set-up change task during device o...
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WO/2012/001539 |
A method for positioning electronic devices into compartments of an input medium is disclosed. At least one electronic device is packable in a single compartment of the input medium. Known positions on an upper side of the input medium a...
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WO/2012/003206 |
The present application provides a merchandiser. The merchandiser may include an ambient compartment with at least one ambient product therein, a temperature controlled compartment with at least one temperature controlled product therein...
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WO/2012/002211 |
The disclosed chip bonder is provided with: a turret that is supported rotatably; a turret-driving motor; and a component-holding unit. A component-holding unit guide device that guides the component-holding unit in the vertical directio...
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WO/2011/160435 |
A group-mounting method for mounting surface mount technology (SMT) electronic components on a circuit board in groups is provided. The method includes: making a group-mounting-nozzle according to the position spacing between the electro...
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WO/2011/161871 |
Provided is a parts mounting system, an image-recognition data creating apparatus, and an image-recognition data creating method, wherein the work load to be incurred upon creating image recognition data can be reduced, to improve workin...
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WO/2011/163209 |
The problem for the present invention is, in a mobile object control system that controls a mobile object on the basis of images captured by a plurality of image capturing units, to enhance the accuracy of the correspondence relationship...
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WO/2011/158826 |
Provided is an exterior inspection device which is capable of accurately inspecting the exterior of an object to be inspected and which is also capable of reducing manufacturing costs. The exterior inspection device is provided with: a l...
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WO/2011/158488 |
A component mounting method includes: an identification step in which an imaging means (123) captures an image of a 2D area containing an attachment surface (202) of a component (200) which is to be attached, and image processing is used...
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WO/2011/145266 |
There have been some cases where it was difficult to perform high-quality ultrasonic bonding using conventional bonding tools. Disclosed is a bonding tool (5) which is provided with: a horn (51) which transmits ultrasonic vibration; an u...
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WO/2011/135938 |
To improve the practical utility of a manufacturing-work machine that carries out manufacturing work by utilizing a plurality of work execution devices. The disclosed manufacturing-work machine includes: a plurality of work execution dev...
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WO/2011/137031 |
A luminaire with a thermal pathway to reduce the junction temperature of the luminaires light source, and methods for so doing, are disclosed. The luminaire includes a can, a light engine, and a trim, that define a substantially continuo...
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WO/2011/135961 |
To improve the practical utility of an integrated control device that exercises integrated control over a plurality of work-element execution devices in a manufacturing-work machine which carries out manufacturing work by utilizing said ...
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WO/2011/135960 |
To improve the practical utility of a manufacturing-work machine that carries out manufacturing work by utilizing a plurality of work-element execution devices. The disclosed manufacturing-work machine includes: a plurality of work-eleme...
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WO/2011/135738 |
Provided is a bulk feeder parts holding case such that desired "parts replenishment work" and "parts changing work" can be appropriately performed through simple replacement work, and that even after replacement, the original functions o...
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WO/2011/135962 |
Disclosed is a production work machine having high versatility. A plurality of work head devices (26, 28) that are different from each other by the type of work executed are provided as work-element execution devices that each execute on...
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WO/2011/132653 |
The disclosed microcomponent alignment unit has a simple structure, making weight reduction easy. Said microcomponent alignment unit includes a microcomponent raising/lowering mechanism which comprises a plurality of microcomponent raisi...
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