Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 1 - 50 out of 59,985

Document Document Title
WO/2021/004117A1
A manufacturing process for an ultrasonic atomization sheet, comprising: S1, cutting a pressure thermosetting conductive adhesive film (2) to be a shape matching a piezoelectric ceramic sheet (3); S2, placing the pressure thermosetting c...  
WO/2021/005644A1
This work management system is applied to a work region where prescribed work is performed by a worker and a robot. This work management system comprises: a control unit which controls a robot such that a preset specific operation is inc...  
WO/2021/007174A1
The disclosure relates to systems, methods and devices for mitigating warpage in printed circuit boards (PCBs) high-frequency connect PCBs (HFCPs), or additively manufactured electronics (AME) with surface mounted chip packages (SMT) dur...  
WO/2021/005667A1
This component mounting device is provided with a head, a nozzle, a sensor, and a control unit. The control unit is configured to perform a calibration process and a mounting process. The control unit, during the calibration process, per...  
WO/2021/004751A1
The invention relates to a method for removing a component (1) applied to a circuit board (2) wherein the component (1) has a housing (11) and a plurality of terminals, wherein each of the terminals is connected by a separate soldered co...  
WO/2021/001962A1
When a mounting operation assigned to a predetermined holding member is determined to be inexecutable on the basis of the result of a recognition process, a control device of this component mounter sets the mounting operation as a skip o...  
WO/2021/002005A1
A component mounting machine comprising a head, a head moving device, an imaging device, and a control device. The control device performs a lower component mounting operation for mounting a lower component on a substrate, an upper compo...  
WO/2021/001996A1
This component mounting system is provided with a plurality of component mounting machines which are arranged in the conveying direction of a substrate and respectively have image capturing devices which capture images of the substrate. ...  
WO/2021/001995A1
This component mounting system is provided with a plurality of component mounting machines which are arranged in the conveying direction of a substrate and respectively have image capturing devices which capture images of the substrate. ...  
WO/2020/264478A1
A system and method for powering electric vehicles and other equipment is provided. In some aspects, an electric vehicle is powered by a modular set of battery modules which are removeable when depleted and individually replaceable with ...  
WO/2020/261489A1
This component mounting machine is provided with: a component supply device for supplying a component; a head with a nozzle; a moving device for moving the head in the X- and Y-directions; and a control device for controlling the respect...  
WO/2020/262086A1
An electronic component reel set that comprises a first electronic component reel and a second electronic component reel. The first electronic component reel comprises: a plurality of first electronic components that each have a first ch...  
WO/2020/255412A1
The present disclosure addresses the problem of providing: an allowance setting system (2) that can appropriately set inspection allowances; a substrate inspection device (33); a allowance setting method; and a substrate inspection metho...  
WO/2020/255186A1
This component mounter is provided with a picking member for picking a component and a control device. When a predetermined error occurs, after performing a picking operation for picking a component using a picking member, the control de...  
WO/2020/251874A1
Presented herein is a tray for shipping, handling, and/or processing optomechanical components. The tray (100) has a plurality of pockets (101) arranged in an array, wherein each pocket is configured to hold one optomechanical component ...  
WO/2020/248698A1
Disclosed are a disassembling, overturning and laminating integrated device and method for an automatic assembly line of a flexible circuit board. The device comprises: a material taking mechanism and an overturning mechanism, wherein th...  
WO/2020/251157A1
A supporter for electronic parts comprises: an absorption plate which is adsorbed to an upper surface of a first electronic part, the first electronic part and a second electronic part being spaced apart from each other on a flat surface...  
WO/2020/250346A1
Provided is a transfer amount measurement method for measuring the amount of transferred transfer material (A) on a transfer target surface (52), after the transfer material which was adhered to the bottom end of a transfer pin (13) has ...  
WO/2020/246339A1
The present invention can pressurize an entire surface substantially uniformly, in a highly precisely positioned state. A substantially planar first suction section suctions a substantially planar first member thereto, a substantially ...  
WO/2020/245983A1
This management device targets a substrate work apparatus that produces a substrate product through a production process in which prescribed work is performed on the substrate. The management device comprises: a storage device that store...  
WO/2020/245945A1
Provided is a parts supply apparatus comprising: a plurality of parts container for storing a plurality of parts; and one stage. The plurality of parts container are attached to the one stage. The plurality of parts are scattered onto th...  
WO/2020/245985A1
A substrate work machine provided with: a backup plate; a backup member disposed on the backup plate and supporting a substrate from below; a moving device for moving the backup member; a movement control unit which controls the operatio...  
WO/2020/246940A1
The present disclosure provides a carrier tape and pocket design that secures small or thin electronic components into pockets while preventing damage from shifting/migrating or becoming incorrectly positioned. In particular, the present...  
WO/2020/240688A1
A fiducial mark allocation method including: allocating at least two fiducial marks out of three or more fiducial marks provided on a board to a component to be used for calculating a correction amount of a mounting position of the compo...  
WO/2020/240681A1
In order to perform a component resupply operation efficiently, the component container storage device according to the present invention is provided with: a storage unit in which a plurality of component containers accommodating compone...  
WO/2020/241753A1
A machining device (1) is provided with: a mounting surface of a mounting table (26) on which a machining target (4) is mounted; a bottom surface that presses the mounted machining target (4); a camera device (32) that photographs the mo...  
WO/2020/240774A1
In the present invention, a timing chart C indicating an execution history of a component mounting operation is displayed on a display 64. In the timing chart C, a plurality of marks M corresponding respectively to a plurality of substra...  
WO/2020/240773A1
In the present invention, displayed on a display 64 (fig. 4—12) are: graphs B2, B3, B4 (constituent element temporal changes) that show changes over time in constituent elements (time operation ratio, performance operation ratio, good ...  
WO/2020/239731A1
The invention relates to a module (300) for initializing and calibrating a product (100) during the manufacture of the product (100) in a manufacturing environment (200), wherein the module (300) is arrangeable on the product (100) and w...  
WO/2020/241839A1
This holding device is provided with a first holding mechanism which includes a pair of first members each capable of moving relative to one another in a first direction, and which is capable of holding an electronic component by sandwic...  
WO/2020/240828A1
This nozzle replacement table unit is provided with: a nozzle container containing a plurality of replacement nozzles; a base to which the nozzle container is detachably mounted; a fixing mechanism for fixing the nozzle container onto th...  
WO/2020/235645A1
A main printed substrate for an electronic device is provided with through-holes 501, 502 that are used to mount multiple types of components. Provided in the surrounding areas of the respective through-holes 501, 502 are lands 51A, 51B ...  
WO/2020/235545A1
An electronic component mounting method for mounting an electronic component over a land, formed on a substrate, via solder comprises: a detecting step for detecting a forming position of a land (51a, 51b) formed on a substrate (30); a s...  
WO/2020/235535A1
The present invention addresses the problem of providing an electronic component attaching device with which it is possible to accurately and efficiently attach an electronic component to an object to be attached onto, and to readily acc...  
WO/2020/227987A1
A high-speed surface mounting and transferring method and device. Said method comprises the following steps: acquiring a linear velocity v of a material platform, a surface mounting speed v, the coordinates of a material, and surface mou...  
WO/2020/231987A1
Disclosed herein are implementations of methods and devices for stacking printed circuit board (PCB) assemblies (PCBA) with a single reflow process which decreases impact on surface mount technology (SMT) component and solder joint relia...  
WO/2020/216894A1
The invention relates to the error identification in a production or processing operation for a component (1), in particular for checking a production or processing operation for a circuit board provided with or to be provided with contr...  
WO/2020/217296A1
This component mounting device (100) is provided with a nozzle shaft (311). The nozzle shaft (311) includes a filter (311d) and a filter state confirmation unit (311f). The filter state confirmation unit is configured such that, dependin...  
WO/2020/217861A1
This work instruction device for a manufacturing plant manufactures products using at least one manufacturing device, and comprises: a robot control unit that controls a work robot that automatically transports members consumed by the ma...  
WO/2020/219429A1
A pick-up tool (PUT) includes a bridge pick-up head. The bridge pick-up head includes: a first bridge leg portion, a second bridge leg portion, and a bridge center portion between the first and second leg portions, the first and second b...  
WO/2020/213502A1
A mounting device (10) that mounts a semiconductor chip (102) on a mounted body comprises: a stage (12) on which the mounted body is placed; a mounting head (16) provided so as to be capable of ascending and descending above the stage (1...  
WO/2020/213107A1
An image search device (20) is provided with an image storage unit (25) in which a plurality of images captured in a mounting step for mounting a component (E) onto a substrate (S) are stored, and a control unit (21) which searches the p...  
WO/2020/213567A1
A mounting device 1 is equipped with: two direct-acting voice coil motors 38 in which a movable element 38c reciprocally moves along an axis A relative to a fixed element 38b; and a collet 34A mounted on an end part side of the movable e...  
WO/2020/208798A1
This component mounter is provided with a head body, a shaft, a component holding member, an elastic member, a characteristic part, an imaging device, and a detection part. The shaft is provided to the head body in a vertically movable m...  
WO/2020/208797A1
This component mounting device is provided with a head body, a shaft, a sleeve, a component holding portion, a first elastic member, a second elastic member, and a detecting portion. The shaft is mounted to the head body in a liftable/lo...  
WO/2020/206758A1
A display panel (1) and a display module. The display panel (1) comprises a display region (11) and a non-display region (12). The non-display region (12) comprises a terminal region (13) and alignment markers (14, 141, 142, 143, 144, 14...  
WO/2020/209269A1
This bonding device 1 is provided with: a tape feeder module 10 which takes out an electronic component 301 from a carrier tape 13 and transfers the electronic component 301 thus taken out; a die supply module 20 which has a die pick-up ...  
WO/2020/209862A1
Example implementations relate to automatically identifying sub-assemblies in a printer system. One example implementation signals a unique connector identifier to a sub-assembly coupled to the printer system. The unique connector identi...  
WO/2020/202155A1
A system and methods are provided for assisting with manual assembly of a printed circuit board (PCB), including a camera, oriented to capture a camera image of some or all of the PCB, and a processor configured to determine according to...  
WO/2020/202248A1
This component mounting system comprises: a component mounting device (15) which mounts a component (E) onto a substrate (S); a component depository (20) which stores a component housing member (200) having, housed therein, a plurality o...  

Matches 1 - 50 out of 59,985