Document Type and Number:
Japanese Patent JP2004040084
Kind Code:
A5
More Like This:
Application Number:
JP2003109640
Publication Date:
May 17, 2012
Export Citation:
International Classes:
H01G4/252; H01G4/30
Previous Patent: MANUFACTURE OF PRINTED WIRING BOARD
Next Patent: COMPONENT FORMATION BY PLATING TECHNIQUE
Next Patent: COMPONENT FORMATION BY PLATING TECHNIQUE