Title:
COMPONENT FORMATION BY PLATING TECHNIQUE
Document Type and Number:
Japanese Patent JP2004040085
Kind Code:
A
Abstract:
To form a conductive feature by a plating technique.
A plated terminal is guided and fixed by an internal electrode tab and additional anchor tab of exposed various types of widths. Such an anchor tab becomes a nucleus of an additional plating material by disposing the tab in or out of a chip structure. A substantially disc-like plating material is formed by exposing a combination of the electrode tab and the anchor tab in respective constitutions. Such a plating material finally forms a substantially spherical ball limiting metallized part by allowing a solder ball to reflow. In the formation of the self-determining plated terminal and the conductive component, different types of plating techniques and materials can be adopted.
Inventors:
GALVAGNI JOHN L
HEISTAND ROBERT II
RITTER ANDREW
MACNEAL JASON
DATTAGURU SRIRAM
HEISTAND ROBERT II
RITTER ANDREW
MACNEAL JASON
DATTAGURU SRIRAM
Application Number:
JP2003109641A
Publication Date:
February 05, 2004
Filing Date:
April 14, 2003
Export Citation:
Assignee:
AVX CORP
International Classes:
C25D7/00; H01G4/01; H01G4/228; H01G4/232; C23C18/38; H01G4/30; (IPC1-7): H01G4/30; C23C18/38; C25D7/00
Domestic Patent References:
| JPH09129476A | 1997-05-16 | |||
| JPH01293503A | 1989-11-27 | |||
| JPH02294007A | 1990-12-05 | |||
| JPH11297566A | 1999-10-29 | |||
| JP2000124057A | 2000-04-28 |
Attorney, Agent or Firm:
Yoshikazu Tani
Kazuo Abe
Kazuo Abe
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