Title:
プラズマ処理装置
Document Type and Number:
Japanese Patent JP2005517809
Kind Code:
A
Abstract:
A sputter apparatus (10) includes a chamber (13a) housing a target (11), a work piece support (12) and a process area (14) between the target and the support. The apparatus further includes an inlet (24) for process gas and a pumping outlet (27) from the process area. The inlet substantially surrounds the support and the apparatus includes a pumping outlet separate from the inlet. The inlet is shielded from the process area.
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Inventors:
Green, gordon, robert
Application Number:
JP2003568119A
Publication Date:
June 16, 2005
Filing Date:
February 04, 2003
Export Citation:
Assignee:
TRIKON TECHNOLOGIES LIMITED
International Classes:
C23C14/34; C23C14/56; H01J37/32; H01J37/34; (IPC1-7): C23C14/34
Attorney, Agent or Firm:
Masayuki Kishida
Mizuno Katsufumi
Hiroshin Takano
Atsushi Mizumoto
Ogawa Hidenori
Mizuno Katsufumi
Hiroshin Takano
Atsushi Mizumoto
Ogawa Hidenori