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Title:
半導体IC欠陥検出の装置および方法
Document Type and Number:
Japanese Patent JP2005519260
Kind Code:
A
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Inventors:
Weiner Kurt H.
Varma Gaulab
Application Number:
JP2003537118A
Publication Date:
June 30, 2005
Filing Date:
October 16, 2002
Export Citation:
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Assignee:
KLA-Tenker Technology Corporation
International Classes:
G01R31/302; G01R31/26; G01R31/307; H01L21/66; H01L23/544; (IPC1-7): G01R31/302; H01L21/66
Domestic Patent References:
JPH11330181A1999-11-30
JPH05144901A1993-06-11
JP2001077163A2001-03-23
Attorney, Agent or Firm:
Meisei International Patent Office



 
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