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Title:
ELEMENT, SEMICONDUCTOR DEVICE, LIGHT-EMITTING DEVICE, DISPLAY DEVICE, PEELING METHOD, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD OF DISPLAY DEVICE
Document Type and Number:
Japanese Patent JP2018174084
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an element, a semiconductor device, a display device and a light-emitting device subjected to thinning and weight-saving, respectively, alternatively, to provide an element, a semiconductor device, a display device and a light-emitting device difficult to break, respectively, alternatively, to provide an element, a semiconductor device, a display device and a light-emitting device having flexibility, respectively.SOLUTION: Provided is an element having a substrate, a first resin layer formed in contact with therewith, a second resin layer formed in contact with the first resin layer, and a first layer formed in contact with the second resin layer, where the second resin layer is principally composed of polyimide resin, and on the boundary surface of the first and second resin layers, a material having a mass-to-charge ratio of 1000-1200, other than the material detected when performing LC/MS measurement of the first resin layer on the opposite side to the boundary surface of the first and second resin layers, is detected. A semiconductor device, a display device and a light-emitting device using the same are also provided, respectively.SELECTED DRAWING: Figure 1

Inventors:
KAWAKAMI SACHIKO
SEO TETSUSHI
KAMISAKA AYAKA
Application Number:
JP2017071723A
Publication Date:
November 08, 2018
Filing Date:
March 31, 2017
Export Citation:
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Assignee:
SEMICONDUCTOR ENERGY LAB CO LTD
International Classes:
H05B33/02; G02F1/1368; G09F9/00; G09F9/30; H01L21/02; H01L21/336; H01L27/32; H01L29/786; H01L51/50; H05B33/10; H05B33/14
Domestic Patent References:
JP2010258037A2010-11-11
JP2011048374A2011-03-10
JP2015079955A2015-04-23
JPH10125931A1998-05-15
Foreign References:
WO2016204121A12016-12-22