Title:
CUTTING DEVICE
Document Type and Number:
Japanese Patent JP2019005854
Kind Code:
A
Abstract:
To reduce chips remaining in a body part of a carrying unit.SOLUTION: A cutting device comprises a cutting unit for dividing a workpiece into chips 103 and a carrying unit for carrying the chips 103 to a chip storage part 60, in which the carrying unit comprises a box-shaped suction pad 71 having an inside space 76 and holding the chips 103 by an undersurface 74a of a cushioning sheet 74, a moving part for moving the suction pad 71, a suction passage connected to the suction pad 71 and making negative pressure act on the undersurface 74a and a pressurized air supply passage 81 connected to the opposite side surface of the undersurface 74a of the suction pad 71 and supplying pressurized air to the inside space 76. The suction pad 71 comprises a plurality of suction holes 75 penetrating through the undersurface 74a from the inside space 76 and a baffle plate 85 installed between a pipe connection opening part 77 of the pressurized air supply passage 81 and the suction holes 75 and straightening the air supplied from the pipe connection opening part 77 in the inside space 76.SELECTED DRAWING: Figure 9
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Inventors:
OMURO YOSHIHIRO
TAKAHASHI MASAYUKI
TAKAHASHI MASAYUKI
Application Number:
JP2017123922A
Publication Date:
January 17, 2019
Filing Date:
June 26, 2017
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24B41/06; B23Q3/08; B24B27/06; H01L21/301; H01L21/683
Domestic Patent References:
| JP2004207424A | 2004-07-22 | |||
| JP2015088558A | 2015-05-07 | |||
| JP2015012264A | 2015-01-19 |
Foreign References:
| US5803797A | 1998-09-08 |
Attorney, Agent or Firm:
Sakai International Patent Office