Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2019062066
Kind Code:
A
Abstract:
To provide a semiconductor device in which a semiconductor module that comprises a resin package encapsulating a semiconductor element, and a resin cooling unit are integrated, and to provide a technology of suppressing time degradation of cooling performance.SOLUTION: A semiconductor device 2 comprises a semiconductor module 10, an insulation sheet 16, a cooling plate 20, and a cooling unit 3. On at least one surface of the semiconductor module 10, a heat radiation plate is exposed. The insulation sheet 16 covers the heat radiation plate. One surface of the cooling plate 20 covers the insulation sheet 16 and is bonded with the one surface of a package 12, and a fin 21 is provided on the other surface of the cooling plate 20. The cooling plate 20 is made of a resin in which a heat transfer material is mixed. The cooling unit 3 is a resin cooling unit that makes cooling medium flow along the fin 21, surrounds the cooling plate 20 when seen from a normal line direction of the cooling plate 20, and is bonded with a pair of both ends of the resin package 12 when seen from the normal line direction.SELECTED DRAWING: Figure 2
Inventors:
KATAYAMA YUKIHISA
YOKOZAWA RYO
TAKAHASHI NAOYOSHI
YOKOZAWA RYO
TAKAHASHI NAOYOSHI
Application Number:
JP2017185098A
Publication Date:
April 18, 2019
Filing Date:
September 26, 2017
Export Citation:
Assignee:
TOYOTA MOTOR CORP
International Classes:
H01L23/473; H01L25/07; H01L25/18
Domestic Patent References:
| JP2016131196A | 2016-07-21 | |||
| JPH04291948A | 1992-10-16 | |||
| JP2014229714A | 2014-12-08 | |||
| JP2015535392A | 2015-12-10 |
Foreign References:
| US5424251A | 1995-06-13 | |||
| CN104956480A | 2015-09-30 |
Attorney, Agent or Firm:
Kaiyu International Patent Office