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Patent Searching and Data


Title:
IMPACT-MODIFIED POLYAMIDE MOLDING COMPOUNDS
Document Type and Number:
Japanese Patent JP2020059850
Kind Code:
A
Abstract:
To provide a polyamide molding compound which has high strength (in particular, expressed by the notch impact strength) and very good optical properties (in particular, expressed by the haze and the light transmittance) in addition to high rigidity (in particular, expressed by the modulus of elasticity in tension).SOLUTION: In addition to a specific amorphous polyamide and a functionalized styrene-butadiene-styrene triblock copolymer as an impact modifier, impact-modified polyamide molding compounds optionally comprise further specific, partially crystalline polyamides and additives.SELECTED DRAWING: None

Inventors:
THOMAS WIEDEMANN
Application Number:
JP2019184324A
Publication Date:
April 16, 2020
Filing Date:
October 07, 2019
Export Citation:
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Assignee:
EMS PATENT AG
International Classes:
C08L77/06; C08K3/00; C08K3/013; C08K5/00; C08K7/00; C08L53/02; C08L77/02
Domestic Patent References:
JP2018095880A2018-06-21
JPH04337355A1992-11-25
Attorney, Agent or Firm:
Patent Business Corporation Minori Patent Office