Title:
【発明の名称】半導体集積回路装置の製造方法
Document Type and Number:
Japanese Patent JP2587424
Kind Code:
B2
More Like This:
Inventors:
NAKADA TAKAAKI
Application Number:
JP11845587A
Publication Date:
March 05, 1997
Filing Date:
May 14, 1987
Export Citation:
Assignee:
NIPPON ELECTRIC CO
International Classes:
H01L29/73; H01L21/331; H01L21/8222; H01L27/06; H01L29/72; (IPC1-7): H01L21/8222; H01L27/06
Domestic Patent References:
| JP5598874A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)