【発明の名称】半導体集積回路装置

Title:

【発明の名称】半導体集積回路装置

Document Type and Number:

Japanese Patent JP3059589

Kind Code:

B2

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Inventors:

Koichi Yamashita

Application Number:

JP26036792A

Publication Date:

July 04, 2000

Filing Date:

September 29, 1992

Export Citation:

Assignee:

富士通株式会社

International Classes:

H01L21/82; H01L27/118; (IPC1-7): H01L27/118; H01L21/82

Domestic Patent References:

Attorney, Agent or Firm:

Keizo Okamoto

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