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Title:
回路接続材料並びに回路端子の接続構造及び接続方法
Document Type and Number:
Japanese Patent JP3587859
Kind Code:
B2
Abstract:
A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.

Inventors:
Izuo Watanabe
Mitsugu Fujinawa
Yasuhiro Arifu
Tomoko Kanazawa
Atsushi Kuwano
Application Number:
JP54145798A
Publication Date:
November 10, 2004
Filing Date:
March 31, 1998
Export Citation:
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Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C09J157/00; C09J201/06; H01B1/20; H01B1/22; H01L21/60; H01L23/29; H05K3/32; C08K5/14; C08K5/521; C08L9/02; C08L13/00; C08L21/00; (IPC1-7): C09J201/00; C08K5/14; C08L61/00; C08L63/00; C08L101/00; C09J9/02; C09J161/00; C09J163/00; H01B1/20; H01L21/60
Domestic Patent References:
JP8325543A
JP8319461A
JP63083181A
JP4275380A
JP61296077A
JP9169958A
JP10273630A
JP10273626A
JP9291259A
JP9118860A
JP9095652A
JP8239641A
JP8239642A
JP6295617A
JP4277585A
Foreign References:
US5475048
Attorney, Agent or Firm:
Yoshiki Hasegawa
Shiro Terasaki