半導体集積回路装置の製造方法

Title:

半導体集積回路装置の製造方法

Document Type and Number:

Japanese Patent JP4173454

Kind Code:

B2

More Like This:

JP4088616	Plasma CVD equipment, substrate processing system, and film forming / self-cleaning method
JP3445585	METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
JPH01220447	PLASMA APPARATUS

Inventors:

Shoichi Uno
Atsushi Maekawa
Takashi Yunoue
Ichino Tako
Kazuo Nojiri
Shuntaro Machida
Tokunaga Naofumi

Application Number:

JP2004049195A

Publication Date:

October 29, 2008

Filing Date:

February 25, 2004

Export Citation:

Assignee:

Renesas Technology Corp.

International Classes:

H01L21/3065; H01L21/768; H01L21/3205; H01L23/522

Domestic Patent References:

Attorney, Agent or Firm:

Yamato Tsutsui

Previous Patent: アンテナ装置

Next Patent: HYDRAULIC DRUM FAN BRAKE