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Title:
床下スペーサー、床暖房構造及びそれを用いた建物
Document Type and Number:
Japanese Patent JP4286590
Kind Code:
B2
Abstract:

To provide an underfloor spacer, a floor heating structure, and a building using it, having superior soundproof performance, walking feeling, and working efficiency.

This underfloor spacer is laid in a peripheral part of a room, adjacently to the peripheral edge of a floor heater composed of a ligneous floor plate material embedded with a heating surface body. The underfloor spacer is composed of a hard foaming body having an average value of the aspect ratio Dz/Dxy of indwelling foam of 1 to 4.0, foaming power of 3 to 20 times, and a compressive elastic modulus or 5 MPa or more. A floor heating structure is used by laminating the underfloor spacer on a floor material composed of a particle board or plywood.

COPYRIGHT: (C)2005,JPO&NCIPI


Inventors:
Hiroshi Moritake
Application Number:
JP2003158340A
Publication Date:
July 01, 2009
Filing Date:
June 03, 2003
Export Citation:
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Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
E04F15/18; F24D13/02
Domestic Patent References:
JP2001355863A
JP2001293829A
JP2001132220A
JP2001295452A