Title:
経糸に予備湿潤を施す糊付機の糊液濃度表示及び制御方法
Document Type and Number:
Japanese Patent JP4294197
Kind Code:
B2
Abstract:
A method of controlling a liquid glue consistency in a liquid glue device to a specified target value with a constant-consistency make-up liquid glue kept supplied. A method of controlling a liquid glue consistency in a gluing device, in a gluing machine that comprises a wetting device (2) and a gluing device (10) and glues warps (1) after wetting them, characterized in that the liquid glue consistency D of the gluing device (10) is detected or estimated, and, when the liquid glue consistency D of the gluing device (10) deviates from a specified control value, wetting to warps (1) is controlled so that a measured value of a pickup ratio PW of water from the wetting device (2) for the warps (1) approaches its target ratio PW to thereby control the liquid glue consistency D to within a specified control value.
Inventors:
Noriko Suso
Akio Hara
Akio Hara
Application Number:
JP2000118759A
Publication Date:
July 08, 2009
Filing Date:
March 15, 2000
Export Citation:
Assignee:
Shikibo Ltd.
International Classes:
D06B23/24; D06B23/28
Domestic Patent References:
| JP3180567A | ||||
| JP693555A | ||||
| JP4352869A |