Title:
クッションシート付ウエハ収納容器
Document Type and Number:
Japanese Patent JP4947631
Kind Code:
B2
Abstract:
An elastic wafer-retaining cushion sheet is disposed at a wafer retaining position on the top of a wafer tray. The wafer-retaining cushion sheet has a releasably suction-adhering surface that releasably adheres by suction to the wafer tray. Consequently, there is no likelihood of the semiconductor wafer being damaged during transport or the like. In addition, the wafer-retaining cushion sheet can be readily attached to and detached from the wafer tray for washing or replacement according to need.
Inventors:
Kasama Nobuyuki
Application Number:
JP2006196764A
Publication Date:
June 06, 2012
Filing Date:
July 19, 2006
Export Citation:
Assignee:
Miraial Co., Ltd.
International Classes:
H01L21/673; B65D85/86
Domestic Patent References:
| JP10050815A | ||||
| JP2006026981A |
Attorney, Agent or Firm:
Kazuhiko Mitsui