Title:
接合材貼付検査装置、実装装置、電気部品の製造方法
Document Type and Number:
Japanese Patent JP4966139
Kind Code:
B2
Abstract:
A bonding agent sticking inspection apparatus includes a photographing section, a movement section, and a control section. The photographing section photographs an image of a substrate. The image includes a sticking expected range indicating a range in which a bonding agent should be positioned. The control section controls the photographing section and the movement section, sets an inspection region having a width equal to the pitch between electrodes in an entire edge part in a direction in which the electrodes are arranged in a peripheral edge part of the sticking expected range in the image, detects a ratio of a nicked part of the bonding agent to the inspection region, and judges whether or not an abnormality is present in the bonding agent on the basis of a comparison between the ratio of the nicked part and a threshold set in advance.
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Inventors:
Daisuke Kobayashi
Application Number:
JP2007238446A
Publication Date:
July 04, 2012
Filing Date:
September 13, 2007
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
H01L21/60
Domestic Patent References:
| JP2007134477A | ||||
| JP2005301405A | ||||
| JP2007142315A | ||||
| JP2007013112A | ||||
| JP2005005619A | ||||
| JP2001160571A |
Attorney, Agent or Firm:
Satoshi Kono
Makoto Nakamura
Kurata Masatoshi
Takashi Mine
Yoshihiro Fukuhara
Sadao Muramatsu
Ryo Hashimoto
Makoto Nakamura
Kurata Masatoshi
Takashi Mine
Yoshihiro Fukuhara
Sadao Muramatsu
Ryo Hashimoto