Title:
ハイブリッド密封構造を備えた密封フィードスルー
Document Type and Number:
Japanese Patent JP5307156
Kind Code:
B2
Abstract:
A power terminal feed-through includes a housing body, a plurality of conductive pins, and a seal structure that hermetically seals the conductive pins to the housing body and electrically insulates the conductive pins from the housing body. The seal structure includes a first material fused to one of the housing body and the conductive pin, and a second material fused to the other one of the housing body and the conductive pin. The first and second materials may be properly chosen to match thermal expansion of the housing body and the conductive pins, respectively.
Inventors:
Rakener, Gabe
Sun, Jean
Card Kika, Prasad S.
Sun, Jean
Card Kika, Prasad S.
Application Number:
JP2010540880A
Publication Date:
October 02, 2013
Filing Date:
December 24, 2008
Export Citation:
Assignee:
Emerson Electric Company
International Classes:
H01R9/16; H01L23/04; H01R43/20
Domestic Patent References:
| JP3034069Y2 |
Attorney, Agent or Firm:
Kurata Masatoshi
Satoshi Kono
Makoto Nakamura
Yoshihiro Fukuhara
Takashi Mine
Toshio Shirane
Sadao Muramatsu
Nobuhisa Nogawa
Katsu Sunagawa
Satoshi Kono
Makoto Nakamura
Yoshihiro Fukuhara
Takashi Mine
Toshio Shirane
Sadao Muramatsu
Nobuhisa Nogawa
Katsu Sunagawa