半導体装置 - Sanken Electric Co., Ltd.

Title:

半導体装置

Document Type and Number:

Japanese Patent JP5691550

Kind Code:

B2

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Inventors:

Hiromori Omori

Application Number:

JP2011011071A

Publication Date:

April 01, 2015

Filing Date:

January 21, 2011

Export Citation:

Assignee:

Sanken Electric Co., Ltd.

International Classes:

H01L29/78; H01L21/336; H01L29/06

Domestic Patent References:

Attorney, Agent or Firm:

Hidekazu Miyoshi
Iwa Saki Kokuni
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu

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