Title:
基板処理装置、半導体装置の製造方法及び加熱装置
Document Type and Number:
Japanese Patent JP5721219
Kind Code:
B2
Abstract:
A substrate processing apparatus includes a heating part including a cylindrical-shaped heat insulator and a heating wire arranged on the inner circumferential surface of the heat insulator, a heat-insulating part configured to define a cylindrical space between the heating part and the heat insulating part, a cooling gas introduction portion coupled to the cylindrical space and provided above the heat-insulating part to surround the heating part, and a cooling gas discharge portion provided at an approximately same height as that of the cooling gas introduction portion in the diameter direction extending from approximately the center of the cooling gas introduction portion.
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Inventors:
Murata etc.
Tetsuya Kosugi
Tetsuya Kosugi
Application Number:
JP2011081466A
Publication Date:
May 20, 2015
Filing Date:
April 01, 2011
Export Citation:
Assignee:
Hitachi Kokusai Electric Co., Ltd.
International Classes:
H01L21/31; C23C16/455; H01L21/22; H01L21/324
Domestic Patent References:
| JP6204155A | ||||
| JP2009033115A | ||||
| JP2000003918A | ||||
| JP2007221019A | ||||
| JP1093130A |
Foreign References:
| WO2008099449A1 |
Attorney, Agent or Firm:
Patent Business Corporation IP Win