Title:
研磨パッド及び研磨パッドの製造方法
Document Type and Number:
Japanese Patent JP5822159
Kind Code:
B2
Abstract:
The purpose of the invention is to provide: a polishing pad that has minute bubbles that are substantially uniform in the thickness direction and is already provided with openings without performing an opening-forming process such as surface grinding; and a manufacturing method for same. A polishing pad manufacturing method comprising: a process (1) of applying a mixed solution containing a polyurethane resin and an organic solvent onto a film-forming base material; after the application process, a process (2) of exposing the polyurethane resin for two minutes or more to an atmosphere of 10-80°C temperature and 65-100% relative humidity; and a process (3) of coagulating the polyurethane resin by immersion in a coagulation solution.
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Inventors:
Hiroshi Kurihara
Fumio Miyazawa
Fumio Miyazawa
Application Number:
JP2011286574A
Publication Date:
November 24, 2015
Filing Date:
December 27, 2011
Export Citation:
Assignee:
Fujibo Holdings Co., Ltd.
International Classes:
B24B37/24; B05D3/10; B05D7/24; C08J5/14; C08J7/043; C08J7/046; C08J7/056; C08J9/28; H01L21/304
Domestic Patent References:
| JP2011051072A | ||||
| JP2011230205A | ||||
| JP62156365A |
Attorney, Agent or Firm:
Koichi Tsujii
Sadao Kumakura
Atsushi Hakoda
Kenji Asai
Kazuo Yamazaki
Satsuki Ichikawa
Yasushi Sasaki
Sadao Kumakura
Atsushi Hakoda
Kenji Asai
Kazuo Yamazaki
Satsuki Ichikawa
Yasushi Sasaki