Title:
セラミック基板
Document Type and Number:
Japanese Patent JP6386854
Kind Code:
B2
Abstract:
A ceramic substrate includes: a plate-shaped substrate main body made of an insulating ceramic material; and a metallization layer primarily made of a conductive material, and formed over an entire perimeter of a surface of the substrate main body, along an outer edge of the surface. The ceramic substrate further includes: a composite material layer interposed between the substrate main body and the metallization layer, formed along the outer edge, and containing a ceramic material that is the same as the ceramic material of the substrate main body, and a conductive material that is the same as the conductive material of the metallization layer; and electrode pads primarily made of a conductive material, and formed at a position on the surface, inward of the metallization layer and the composite material layer, and spaced apart from the metallization layer and the composite material layer.
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Inventors:
Ryota Fukui
Kazushige Akita
Kazushige Akita
Application Number:
JP2014197841A
Publication Date:
September 05, 2018
Filing Date:
September 29, 2014
Export Citation:
Assignee:
Nippon Special Ceramics Co., Ltd.
International Classes:
H01L23/02; H01L23/08; H03H9/25
Domestic Patent References:
| JP2010057095A | ||||
| JP2012142691A | ||||
| JP2001291796A | ||||
| JP1197378A | ||||
| JP2013236038A |
Foreign References:
| WO2013137214A1 | ||||
| WO2014148457A1 | ||||
| WO2012060341A1 |
Attorney, Agent or Firm:
Meisei International Patent Office