Title:
【発明の名称】半導体用リードフレームとその製造法
Document Type and Number:
Japanese Patent JPH07120740
Kind Code:
B2
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Inventors:
Takaaki Mitsui
Application Number:
JP23082788A
Publication Date:
December 20, 1995
Filing Date:
September 13, 1988
Export Citation:
Assignee:
Mitsui High Tech Co., Ltd.
International Classes:
H01L23/50; (IPC1-7): H01L23/50
Domestic Patent References:
| JP60196962A | ||||
| JP6091659A | ||||
| JP48102060A |
Attorney, Agent or Firm:
Masashi Kobori (1 person outside)
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