Title:
【発明の名称】半導体へのアルミニウム拡散法
Document Type and Number:
Japanese Patent JPS5833694
Kind Code:
B2
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Inventors:
MONMA NAOHIRO
TANIGUCHI HIROYUKI
TANIGUCHI HIROYUKI
Application Number:
JP14069077A
Publication Date:
July 21, 1983
Filing Date:
November 25, 1977
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L21/223; (IPC1-7): H01L21/223
Attorney, Agent or Firm:
Akio Takahashi