Title:
ACCELERATION SENSOR
Document Type and Number:
Japanese Patent JP2010210423
Kind Code:
A
Abstract:
To provide an easily-miniaturizable acceleration sensor.
An electrode block 8 made of a silicon substrate is bonded onto the under surface of an upper cover 2a. The electrode block 8 includes a frame part 80 bonded to a frame part 3 of a sensor chip 1, and first and second fixed electrodes 81a, 81b, 82a, 82b. The first and second fixed electrodes 81a, 81b, 82a, 82b exposed to the upper surface side of the upper cover 2a through a through-hole 20 are used as electrode parts 83a, 83b, 84a, 84b for taking out a detection voltage. Resultantly, an exclusive space for providing the electrode parts which has been necessary for a conventional example becomes unnecessary, to thereby achieve miniaturization easily.
Inventors:
UEDA HIDEKI
IBARA NOBUYUKI
YOSHIDA HITOSHI
OKADA MASAFUMI
MORI TAKASHI
IBARA NOBUYUKI
YOSHIDA HITOSHI
OKADA MASAFUMI
MORI TAKASHI
Application Number:
JP2009056948A
Publication Date:
September 24, 2010
Filing Date:
March 10, 2009
Export Citation:
Assignee:
PANASONIC ELEC WORKS CO LTD
International Classes:
G01P15/08; G01P15/125; G01P15/18; H01L29/84
Domestic Patent References:
| JP2006170893A | 2006-06-29 | |||
| JP2000028463A | 2000-01-28 | |||
| JP2008292427A | 2008-12-04 | |||
| JP2004333133A | 2004-11-25 | |||
| JP2006170893A | 2006-06-29 |
Foreign References:
| WO2008093693A1 | 2008-08-07 |
Attorney, Agent or Firm:
Keisei Nishikawa