Title:
接着剤組成物、接着シート及び半導体装置
Document Type and Number:
Japanese Patent JP5664455
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an adhesive composition, which can secure curability capable of responding to a lower temperature of heat history received in an assembling step after die bonding while satisfying thin film generating properties, processability at low temperatures (low-temperature applicability) and high adhesiveness at high temperatures which is needed for reflow resistance, and can further attain higher elasticity.SOLUTION: The adhesive composition includes (A) a thermoplastic resin and (B) a thermosetting component. The thermoplastic resin (A) contains (A1) a polyimide resin having a glass transition temperature of 60°C or lower and a weight average molecular weight of 10,000-100,000; and (A2) a non-polyimide resin in which the viscosity at 25°C is 10 poises or more when it is dissolved in N-methyl-2-pyrolidone so that the resin content is 20 mass%. The thermosetting component (B) contains (B1) an epoxy resin and (B2) a bismaleimide resin.
Inventors:
増子 崇
黒澤 悟史
黒澤 悟史
Application Number:
JP2011113900A
Publication Date:
February 04, 2015
Filing Date:
May 20, 2011
Export Citation:
Assignee:
日立化成株式会社
International Classes:
C09J179/08; C09J7/00; C09J7/02; C09J129/14; C09J133/14; C09J163/00; C09J175/04; H01L21/52
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Junichiro Sakamaki
Yoshinori Shimizu
Hiroyuki Hirano
Junichiro Sakamaki