PURPOSE: To obtain an angular polishing jig, for semiconductor use, which can select and simultaneously polish a plurality of angles by using one head by a method wherein a pasting face, of a material to be polished, of a head for polishing use is divided into two from the center of the head and has mutually different angles with reference to a horizontal face.

CONSTITUTION: This is an angule polishing jig provided with a circular head 1 for polishing use; and a pasting face, of a material to be polished, of said head 1 is divided into two from the center of the head 1 and has mutually different angles with reference to a horizontal face. Alternatively, two pasting faces of the material to be polished have a plurality of different angle faces inside respective faces. For example, as shown in the figure, this jug is formed as a polishing jig, for semiconductor use, provided with a head 1 having two angles which is designated as a two-way head or provided with a head 1 having four angles which is designated as a four-way head. Thereby, a maximum of four kinds of angles can be selected or polished simultaneously by using one head.