Title:
APPARATUS AND METHOD FOR MOUNTING CONDUCTIVE BALLS
Document Type and Number:
Japanese Patent JP3803439
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an apparatus and method of surely mounting conductive balls such as solder balls on electrodes of a work.
SOLUTION: A mounting head 20 is composed of a block 31 housed in a box 30 and a vacuum tool 32 at the lower part of the block 31. The box 30 is coupled with the block 31 through springs 40 to offset the wt. of the tool 32 and provided with a cylinder 38 for coupling its rod 39 with the block 31. The cylinder 38 presses vacuum-chucked solder balls 1 at vacuum holes 35 of the tool 32 to electrodes 12 of a work 11. The side end of the block 31 is pressed to a stopper 30a of the box 30 enough to make the lower face of the tool 32 perfectly horizontal, thus landing all the solder balls 1 on the electrodes 12 of the work 11.
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Inventors:
Shinichi Nakazato
Application Number:
JP31595396A
Publication Date:
August 02, 2006
Filing Date:
November 27, 1996
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
B23P21/00; H05K3/34; H01L21/60; (IPC1-7): H05K3/34; B23P21/00; H01L21/60; H01L21/321
Domestic Patent References:
| JP8115916A | ||||
| JP7307344A | ||||
| JP7193097A | ||||
| JP413583A |
Attorney, Agent or Firm:
Fumio Iwahashi
Hiroki Naito
Daisuke Nagano
Hiroki Naito
Daisuke Nagano
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